View source for International business machines corporation (20240112056). ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS simplified abstract

=ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS=


==Organization Name==

[[:Category:international business machines corporation|international business machines corporation]]


[[Category:international business machines corporation]]

==Inventor(s)==

[[:Category:Vivekananda P. Adiga of Ossining NY (US)|Vivekananda P. Adiga of Ossining NY (US)]][[Category:Vivekananda P. Adiga of Ossining NY (US)]]

[[:Category:Russell A. Budd of North Salem NY (US)|Russell A. Budd of North Salem NY (US)]][[Category:Russell A. Budd of North Salem NY (US)]]

[[:Category:Charles Thomas Rettner of San Jose CA (US)|Charles Thomas Rettner of San Jose CA (US)]][[Category:Charles Thomas Rettner of San Jose CA (US)]]

[[:Category:Stephen M. Gates of New York NY (US)|Stephen M. Gates of New York NY (US)]][[Category:Stephen M. Gates of New York NY (US)]]

==ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240112056 titled 'ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS

==Simplified Explanation==

The abstract describes a method of constructing a superconducting switch by fabricating a superconducting metal line on a substrate and releasing the center portion of the line through etch release holes to reduce undercut distance.

* Superconducting switch construction method:
  * Provide a substrate.
  * Fabricate a superconducting metal line on the substrate.
  * Pattern the line along a first crystalline direction.
  * Create etch release holes in the center portion of the line.
  * Release the center portion from the substrate with an anisotropic etch through the holes.

== Potential Applications ==
The technology could be applied in:
* Superconducting electronics
* Quantum computing
* Magnetic resonance imaging (MRI) machines

== Problems Solved ==
This technology addresses:
* Improving superconducting switch performance
* Reducing undercut distance during fabrication
* Enhancing overall device efficiency

== Benefits ==
The benefits of this technology include:
* Increased reliability of superconducting switches
* Enhanced precision in device fabrication
* Improved functionality in superconducting applications

== Potential Commercial Applications ==
This technology could be utilized in:
* High-speed computing systems
* Medical imaging equipment
* Aerospace technology development

== Possible Prior Art ==
One possible prior art for this technology could be the use of anisotropic etching techniques in microfabrication processes to create intricate structures with high precision.

=== Unanswered Questions ===

=== How does this technology compare to existing superconducting switch fabrication methods? ===
This article does not provide a direct comparison with existing methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.

=== What are the specific materials and equipment required for implementing this superconducting switch construction method? ===
The article does not delve into the detailed materials and equipment needed for carrying out this fabrication process, leaving a gap in practical implementation knowledge.


==Original Abstract Submitted==

a method of constructing a superconducting switch includes providing a substrate. a first superconducting metal line is fabricated on the substrate, wherein the superconducting metal line has a left portion, a right portion, and a center portion patterned along a first crystalline direction of the substrate. one or more etch release holes are provided in the center portion of the first superconducting metal line. the center portion of the superconducting metal line is released from the substrate with an anisotropic etch through the etch release holes in a manner that reduces the undercut distance elsewhere on the substrate



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