View source for Intel corporation (20250079300). MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

=MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:Aleksandar Aleksov of Chandler AZ (US)|Aleksandar Aleksov of Chandler AZ (US)]][[Category:Aleksandar Aleksov of Chandler AZ (US)]]

[[:Category:Neelam Prabhu Gaunkar of Chandler AZ (US)|Neelam Prabhu Gaunkar of Chandler AZ (US)]][[Category:Neelam Prabhu Gaunkar of Chandler AZ (US)]]

[[:Category:Henning Braunisch of Phoenix AZ (US)|Henning Braunisch of Phoenix AZ (US)]][[Category:Henning Braunisch of Phoenix AZ (US)]]

[[:Category:Wenhao Li of Chandler AZ (US)|Wenhao Li of Chandler AZ (US)]][[Category:Wenhao Li of Chandler AZ (US)]]

[[:Category:Feras Eid of Chandler AZ (US)|Feras Eid of Chandler AZ (US)]][[Category:Feras Eid of Chandler AZ (US)]]

[[:Category:Georgios C. Dogiamis of Chandler AZ (US)|Georgios C. Dogiamis of Chandler AZ (US)]][[Category:Georgios C. Dogiamis of Chandler AZ (US)]]

==MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING==


This abstract first appeared for US patent application 20250079300 titled 'MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

==Original Abstract Submitted==

magnetic inductors for microelectronics packages are provided. magnetic inductive structures include a magnetic region, a magnetic region base region, and a conductive region that forms a channel within the magnetic region. the magnetic region has a different chemical composition than the base region. additional structures are provided in which the magnetic region is recessed into a package substrate core. further inductor structures are provided in which the conductive region includes through-core vias and the conductive region at least partially encircles a portion of a package substrate core. additionally, methods of manufacture are provided for semiconductor packages that include magnetic inductors.



[[Category:H01L23/522]]
[[Category:H01F1/03]]
[[Category:H01F41/16]]
[[Category:CPC_H01L23/5227]]