View source for Intel corporation (20250062576). EDGE MOUNT MEMORY CONNECTOR FOOTPRINT

=EDGE MOUNT MEMORY CONNECTOR FOOTPRINT=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:Landon Hanks of Milwaukie OR (US)|Landon Hanks of Milwaukie OR (US)]][[Category:Landon Hanks of Milwaukie OR (US)]]

==EDGE MOUNT MEMORY CONNECTOR FOOTPRINT==


This abstract first appeared for US patent application 20250062576 titled 'EDGE MOUNT MEMORY CONNECTOR FOOTPRINT

==Original Abstract Submitted==

a dual inline memory module (dimm) connector has pins to connect to pad footprints and signal routing that reduces crosstalk and noise. the shape and placement of ground pads and signal pads can improve grounding of noise signals and improve the signal isolation on the signal pins. the ground pads can have additional ground vias to increase the ground path to the ground plane.



[[Category:H01R13/6471]]
[[Category:G06F1/18]]
[[Category:H01R12/70]]
[[Category:H01R13/24]]
[[Category:CPC_H01R13/6471]]