View source for Intel corporation (20240215163). SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION simplified abstract

=SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:Onur Ozkan of Scottsdale AZ (US)|Onur Ozkan of Scottsdale AZ (US)]][[Category:Onur Ozkan of Scottsdale AZ (US)]]

[[:Category:Jacob Vehonsky of Gilbert AZ (US)|Jacob Vehonsky of Gilbert AZ (US)]][[Category:Jacob Vehonsky of Gilbert AZ (US)]]

[[:Category:Vinith Bejugam of Chandler AZ (US)|Vinith Bejugam of Chandler AZ (US)]][[Category:Vinith Bejugam of Chandler AZ (US)]]

[[:Category:Nicholas S. Haehn of Scottsdale AZ (US)|Nicholas S. Haehn of Scottsdale AZ (US)]][[Category:Nicholas S. Haehn of Scottsdale AZ (US)]]

[[:Category:Andrea Nicolas Flores of Chandler AZ (US)|Andrea Nicolas Flores of Chandler AZ (US)]][[Category:Andrea Nicolas Flores of Chandler AZ (US)]]

[[:Category:Mao-Feng Tseng of Tempe AZ (US)|Mao-Feng Tseng of Tempe AZ (US)]][[Category:Mao-Feng Tseng of Tempe AZ (US)]]

==SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240215163 titled 'SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION

'''Simplified Explanation:'''
The patent application describes a package core that includes a substrate made of glass with electrically conductive features embedded within it.

* The package core consists of a glass substrate with a via that is electrically conductive.
* A recess is formed on the substrate's surface, and an electrically conductive trace is embedded within it.

'''Key Features and Innovation:'''
* Glass substrate with electrically conductive via.
* Recess on the substrate's surface with an embedded electrically conductive trace.

'''Potential Applications:'''
This technology could be used in electronic packaging, circuit boards, and other electrical applications.

'''Problems Solved:'''
This technology provides a way to integrate electrically conductive features into a glass substrate, which was previously challenging.

'''Benefits:'''
* Enhanced electrical conductivity in glass substrates.
* Improved integration of electrical components in packaging.

'''Commercial Applications:'''
Potential commercial applications include electronics manufacturing, semiconductor industry, and telecommunications.

'''Questions about the Technology:'''
1. How does the integration of electrically conductive features in glass substrates impact the efficiency of electronic devices?
2. What are the potential cost implications of using this technology in mass production?

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==Original Abstract Submitted==

embodiments disclosed herein include a package core. in an embodiment, the package core comprises a substrate with a first surface and a second surface opposite from the first surface. in an embodiment, the substrate comprise glass. in an embodiment, a via is provided through the substrate, where the via is electrically conductive. in an embodiment, a recess is formed into the first surface of the substrate, and a trace is embedded in the recess. in an embodiment, the trace is electrically conductive.



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