View source for Intel corporation (20240213111). CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract

=CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:Mohammad Mamunur Rahman of Gilbert AZ (US)|Mohammad Mamunur Rahman of Gilbert AZ (US)]][[Category:Mohammad Mamunur Rahman of Gilbert AZ (US)]]

[[:Category:Je-Young Chang of Tempe AZ (US)|Je-Young Chang of Tempe AZ (US)]][[Category:Je-Young Chang of Tempe AZ (US)]]

[[:Category:Jeremy D. Ecton of Gilbert AZ (US)|Jeremy D. Ecton of Gilbert AZ (US)]][[Category:Jeremy D. Ecton of Gilbert AZ (US)]]

[[:Category:Rahul N. Manepalli of Chandler AZ (US)|Rahul N. Manepalli of Chandler AZ (US)]][[Category:Rahul N. Manepalli of Chandler AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Brandon C. Marin of Gilbert AZ (US)|Brandon C. Marin of Gilbert AZ (US)]][[Category:Brandon C. Marin of Gilbert AZ (US)]]

[[:Category:Suddhasattwa Nad of Chandler AZ (US)|Suddhasattwa Nad of Chandler AZ (US)]][[Category:Suddhasattwa Nad of Chandler AZ (US)]]

==CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240213111 titled 'CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE

The abstract of this patent application describes electronic packages with a core made of glass, featuring a channel on one surface sealed by a lid.

*Simplified Explanation:
- Electronic packages with a glass core and a sealed channel.

*Key Features and Innovation:
- Core made of glass.
- Channel on core surface.
- Lid sealing the channel.

*Potential Applications:
- Electronics industry for packaging components.

*Problems Solved:
- Protection and organization of electronic components.

*Benefits:
- Enhanced durability and organization of electronic packages.

*Commercial Applications:
- Potential use in consumer electronics manufacturing.

*Questions about Electronic Packages:
1. How does the glass core enhance the electronic package's performance?
- The glass core provides durability and thermal stability to the package.

2. What are the advantages of having a sealed channel in the electronic package?
- The sealed channel allows for organized routing of electrical connections within the package.


==Original Abstract Submitted==

embodiments disclosed herein include electronic packages. in an embodiment, the electronic package comprises a core with a first surface and a second surface opposite from the first surface, and where the core comprises glass. in an embodiment, a channel is disposed into the first surface of the core, and a lid is provided over the channel. in an embodiment, the lid seals the channel between a first end and a second end of the channel.



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