View source for Intel corporation (20240210988). Composite Materials for Electronic Device Chassis and Related Methods simplified abstract

=Composite Materials for Electronic Device Chassis and Related Methods=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:David Pidwerbecki of Portland OR (US)|David Pidwerbecki of Portland OR (US)]][[Category:David Pidwerbecki of Portland OR (US)]]

[[:Category:Arvind S of Bangalore (IN)|Arvind S of Bangalore (IN)]][[Category:Arvind S of Bangalore (IN)]]

[[:Category:Jeff Ku of Taipei City (TW)|Jeff Ku of Taipei City (TW)]][[Category:Jeff Ku of Taipei City (TW)]]

[[:Category:Juha Tapani Paavola of Hillsboro OR (US)|Juha Tapani Paavola of Hillsboro OR (US)]][[Category:Juha Tapani Paavola of Hillsboro OR (US)]]

[[:Category:Prakash Kurma Raju of Bangalore (IN)|Prakash Kurma Raju of Bangalore (IN)]][[Category:Prakash Kurma Raju of Bangalore (IN)]]

[[:Category:Amruta Krishnakumar Ranade of Bengaluru (IN)|Amruta Krishnakumar Ranade of Bengaluru (IN)]][[Category:Amruta Krishnakumar Ranade of Bengaluru (IN)]]

[[:Category:Sudheera Sudhakar of Bangalore (IN)|Sudheera Sudhakar of Bangalore (IN)]][[Category:Sudheera Sudhakar of Bangalore (IN)]]

[[:Category:Mousumi Deka of Bangalore (IN)|Mousumi Deka of Bangalore (IN)]][[Category:Mousumi Deka of Bangalore (IN)]]

[[:Category:Snehal Chaudhari of Bangalore (IN)|Snehal Chaudhari of Bangalore (IN)]][[Category:Snehal Chaudhari of Bangalore (IN)]]

[[:Category:Akarsha R. Kadadevaramath of Tumkur (IN)|Akarsha R. Kadadevaramath of Tumkur (IN)]][[Category:Akarsha R. Kadadevaramath of Tumkur (IN)]]

==Composite Materials for Electronic Device Chassis and Related Methods - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240210988 titled 'Composite Materials for Electronic Device Chassis and Related Methods

'''Simplified Explanation:'''
The patent application relates to composite materials for electronic device chassis, such as a layer of magnesium alloy or polyether ether ketone and carbon fiber reinforced plastic with an anodized aluminum coating.

'''Key Features and Innovation:'''
* Electronic device chassis with composite materials for improved durability and strength.
* Use of magnesium alloy or polyether ether ketone and carbon fiber reinforced plastic for lightweight yet sturdy construction.
* Anodized aluminum coating for added protection and aesthetic appeal.

'''Potential Applications:'''
The technology can be applied in various electronic devices such as smartphones, laptops, tablets, and other portable gadgets.

'''Problems Solved:'''
The technology addresses the need for lightweight yet durable materials for electronic device chassis to protect internal components.

'''Benefits:'''
* Enhanced durability and strength of electronic device chassis.
* Lightweight construction for improved portability.
* Anodized aluminum coating provides protection against wear and tear.

'''Commercial Applications:'''
Potential commercial applications include the manufacturing of electronic devices with durable and lightweight chassis, appealing to consumers looking for high-quality products.

'''Questions about Composite Materials for Electronic Device Chassis:'''
1. What are the key materials used in the composite materials for electronic device chassis?
2. How does the anodized aluminum coating benefit the electronic device chassis?

'''Frequently Updated Research:'''
There may be ongoing research on the development of new composite materials for electronic device chassis to further improve durability and performance.


==Original Abstract Submitted==

systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. an example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.



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