View source for Intel corporation (20240162058). TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING simplified abstract

=TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:Christopher J. Jezewski of Portland OR (US)|Christopher J. Jezewski of Portland OR (US)]][[Category:Christopher J. Jezewski of Portland OR (US)]]

==TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240162058 titled 'TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING

==Simplified Explanation==

The patent application describes tools and methods for subtractively patterning metals such as copper and platinum at pitches lower than achievable by conventional etch tools, with aspect ratios greater than achievable by conventional etch tools, and in a cost-effective manner suitable for high-volume manufacturing.

* Subtractive patterning of metals at lower pitches than conventional etch tools
* Subtractive patterning of metals with greater aspect ratios than conventional etch tools
* Cost-effective tools and methods suitable for high-volume manufacturing

== Potential Applications ==
The technology could be applied in the semiconductor industry for creating high-density metal interconnects, in the electronics industry for producing advanced circuitry, and in the aerospace industry for manufacturing lightweight metal components with intricate patterns.

== Problems Solved ==
The technology solves the problem of limited pitch and aspect ratio capabilities in conventional etch tools, enabling the production of more advanced and complex metal patterns for various applications.

== Benefits ==
The benefits of this technology include the ability to achieve finer metal patterns, higher aspect ratios, and cost-effective manufacturing processes for a wide range of industries.

== Potential Commercial Applications ==
The technology could find commercial applications in semiconductor manufacturing, electronics production, aerospace engineering, and other industries requiring precise metal patterning for their products.

== Possible Prior Art ==
One possible prior art could be the use of laser ablation techniques for metal patterning, which may have limitations in terms of pitch and aspect ratio capabilities compared to the tools and methods described in the patent application.

=== Unanswered Questions ===

== How does the technology compare to other advanced metal patterning techniques in terms of cost and efficiency? ==
The article does not provide a direct comparison with other advanced metal patterning techniques in terms of cost and efficiency. Further research or data would be needed to address this question.

== What are the environmental implications of using the tools and methods described in the patent application? ==
The article does not discuss the environmental implications of using the tools and methods described. Additional information or studies would be required to assess the environmental impact of this technology.


==Original Abstract Submitted==

disclosed herein are tools and methods for subtractively patterning metals. these tools and methods may permit the subtractive patterning of metal (e.g., copper, platinum, etc.) at pitches lower than those achievable by conventional etch tools and/or with aspect ratios greater than those achievable by conventional etch tools. the tools and methods disclosed herein may be cost-effective and appropriate for high-volume manufacturing, in contrast to conventional etch tools.



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