View source for IMEC VZW (20240297136). METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE simplified abstract

=METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE=


==Organization Name==

[[:Category:IMEC VZW|IMEC VZW]]


[[Category:IMEC VZW]]

==Inventor(s)==

[[:Category:Jaber Derakhshandeh of Tienen (BE)|Jaber Derakhshandeh of Tienen (BE)]][[Category:Jaber Derakhshandeh of Tienen (BE)]]

[[:Category:Vadiraj Manjunath Ananthapadmanabha Rao of Leuven (BE)|Vadiraj Manjunath Ananthapadmanabha Rao of Leuven (BE)]][[Category:Vadiraj Manjunath Ananthapadmanabha Rao of Leuven (BE)]]

[[:Category:Danny Wan of Leuven (BE)|Danny Wan of Leuven (BE)]][[Category:Danny Wan of Leuven (BE)]]

[[:Category:Eric Beyne of Heverlee (BE)|Eric Beyne of Heverlee (BE)]][[Category:Eric Beyne of Heverlee (BE)]]

[[:Category:Kristiaan De Greve of Heverlee (BE)|Kristiaan De Greve of Heverlee (BE)]][[Category:Kristiaan De Greve of Heverlee (BE)]]

[[:Category:Anton Potocnik of Leuven (BE)|Anton Potocnik of Leuven (BE)]][[Category:Anton Potocnik of Leuven (BE)]]

==METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240297136 titled 'METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE

==Simplified Explanation==
Superconducting solder bumps are created on a qubit substrate using electrodeposition. The process involves forming a protection layer on the substrate, depositing thin layers for electrodeposition, and then removing the seed layer locally to create the solder bumps.

* Protection layer formed on the substrate
* Thin layers deposited for electrodeposition
* Seed layer removed locally to create solder bumps

==Key Features and Innovation==
* Utilizes electrodeposition to create superconducting solder bumps on a qubit substrate
* Protection layer and seed layer are used to facilitate the electrodeposition process
* Local removal of the seed layer allows for precise formation of solder bumps

==Potential Applications==
* Quantum computing
* Superconducting electronics
* High-speed data processing

==Problems Solved==
* Precise fabrication of superconducting solder bumps on qubit substrates
* Enhanced connectivity in quantum devices
* Improved performance of superconducting electronics

==Benefits==
* Increased efficiency in quantum computing systems
* Enhanced reliability of superconducting devices
* Facilitates advancements in high-speed data processing

==Commercial Applications==
* Quantum computing technology development
* Superconducting electronics manufacturing
* High-performance computing applications

==Prior Art==
Further research can be conducted in the field of superconducting solder bump fabrication techniques to explore existing methods and technologies.

==Frequently Updated Research==
Ongoing research in the field of quantum computing and superconducting electronics may provide new insights into the fabrication of superconducting solder bumps.

==Questions about Superconducting Solder Bumps==
===What are the potential challenges in scaling up the production of superconducting solder bumps for commercial applications?===
Scaling up production may require optimization of electrodeposition processes and materials to meet industry standards and demands.

===How do superconducting solder bumps contribute to the performance of qubit-based systems in quantum computing?===
Superconducting solder bumps enable reliable connections between qubits, enhancing the overall performance and efficiency of quantum computing systems.


==Original Abstract Submitted==

superconducting solder bumps are produced on a qubit substrate by electrodeposition. the substrate comprises qubit areas, and superconducting contact pads connected to the qubit areas. first a protection layer is formed on the substrate, and patterned so as to cover at least the qubit areas. then one or more thin layers are deposited conformally on the patterned protection layer, the thin layers comprising at least a non-superconducting layer suitable for acting as a seed layer for the electrodeposition of the solder bumps. the seed layer is removed locally in areas which lie within the surface area of respective contact pads. this is done by producing and patterning a mask layer, so that openings are formed therein, and by removing the seed layer from the bottom of the openings. the solder bumps are formed by electrodeposition of the solder material on the bottom of the openings. after the formation of the solder bumps, the seed layer and the protection layer are removed.



[[Category:H01L23/00]]
[[Category:H10N60/01]]
[[Category:H10N60/81]]
[[Category:CPC_H01L24/11]]