View source for Hyundai motor company (20240431071). POWER MODULE COOLING DEVICE

=POWER MODULE COOLING DEVICE=


==Organization Name==

[[:Category:hyundai motor company|hyundai motor company]]


[[Category:hyundai motor company]]

==Inventor(s)==

[[:Category:Sang Hun Lee of Taebaek-Si (KR)|Sang Hun Lee of Taebaek-Si (KR)]][[Category:Sang Hun Lee of Taebaek-Si (KR)]]

[[:Category:Hyong Joon Park of Hwaseong-Si (KR)|Hyong Joon Park of Hwaseong-Si (KR)]][[Category:Hyong Joon Park of Hwaseong-Si (KR)]]

[[:Category:Se Heun Kwon of Incheon (KR)|Se Heun Kwon of Incheon (KR)]][[Category:Se Heun Kwon of Incheon (KR)]]

==POWER MODULE COOLING DEVICE==


This abstract first appeared for US patent application 20240431071 titled 'POWER MODULE COOLING DEVICE




==Original Abstract Submitted==

a power module cooling device includes a manifold cover and a fin plate contained in the manifold cover, wherein a cooling fluid is ejected perpendicularly to heating surfaces through cooling fins of the fin plate configured perpendicularly to the longitudinal direction of the manifold cover so that a vertical turbulent flow of the cooling fluid is generated, thereby securing cooling efficiency, and flow characteristics of the cooling fluid are improved, minimizing flow rate loss due to the vertical turbulent flow. respective cooling channel portions of the manifold cover corresponding to respective power modules have different cooling performances so that respective power modules are cooled in a balanced manner. accordingly, cooling imbalance is removed, and the power modules are thus stabilized and maintain performance.



[[Category:H05K7/20]]
[[Category:CPC_H05K7/20272]]