View source for Hyundai motor company (20240421106). POWER MODULE

=POWER MODULE=


==Organization Name==

[[:Category:hyundai motor company|hyundai motor company]]


[[Category:hyundai motor company]]

==Inventor(s)==

[[:Category:Jin Myeong Yang of Seongnam-Si (KR)|Jin Myeong Yang of Seongnam-Si (KR)]][[Category:Jin Myeong Yang of Seongnam-Si (KR)]]

[[:Category:Sung Won Park of Incheon (KR)|Sung Won Park of Incheon (KR)]][[Category:Sung Won Park of Incheon (KR)]]

[[:Category:Han Jin Do of Incheon (KR)|Han Jin Do of Incheon (KR)]][[Category:Han Jin Do of Incheon (KR)]]

==POWER MODULE==


This abstract first appeared for US patent application 20240421106 titled 'POWER MODULE




==Original Abstract Submitted==

introduced is a power module including a first substrate and a second substrate, a semiconductor chip, and a via spacer electrically connecting the first substrate and the second substrate, wherein the via spacer includes a first portion electrically connected to the first substrate, a second portion electrically connected to the second substrate, and a resistor portion including a resistance value greater than resistance values of the first portion and the second portion and arranged between the first portion and the second portion.



[[Category:H01L23/48]]
[[Category:H01L23/00]]
[[Category:H01L23/498]]
[[Category:H01L23/64]]
[[Category:CPC_H01L23/647]]