View source for Dell products l.p. (20240341065). COOLING INSERTS AND ADAPTED HEAT SINKS simplified abstract

=COOLING INSERTS AND ADAPTED HEAT SINKS=


==Organization Name==

[[:Category:dell products l.p.|dell products l.p.]]


[[Category:dell products l.p.]]

==Inventor(s)==

[[:Category:Emily Clark of Round Rock TX (US)|Emily Clark of Round Rock TX (US)]][[Category:Emily Clark of Round Rock TX (US)]]

[[:Category:Timothy Shedd of Lithia FL (US)|Timothy Shedd of Lithia FL (US)]][[Category:Timothy Shedd of Lithia FL (US)]]

==COOLING INSERTS AND ADAPTED HEAT SINKS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240341065 titled 'COOLING INSERTS AND ADAPTED HEAT SINKS

The patent application discusses cooling inserts and adapted heat sinks in an information handling system.

* The innovation includes a cooling insert placed between two flat surfaces, with supports and twists for efficient heat dissipation.
* The cooling insert features twists with cutouts for improved airflow and cooling performance.

Potential Applications:
* This technology can be applied in electronic devices to enhance thermal management and prevent overheating.
* It can be utilized in servers, laptops, and other computing systems to improve overall performance and longevity.

Problems Solved:
* Addresses the issue of heat buildup in electronic devices, which can lead to performance degradation and hardware failure.
* Solves the challenge of maintaining optimal operating temperatures in compact and densely packed systems.

Benefits:
* Improved thermal efficiency and heat dissipation.
* Enhanced reliability and longevity of electronic components.
* Reduced risk of overheating-related malfunctions.

Commercial Applications:
* This technology can be valuable in the consumer electronics industry, data centers, and server farms.
* It has the potential to be integrated into various electronic devices to enhance their performance and reliability.

Questions about Cooling Inserts and Adapted Heat Sinks:
1. How does the cooling insert improve heat dissipation in electronic devices?
2. What are the key features of the twists in the cooling insert and how do they contribute to better cooling performance?

Frequently Updated Research:
Ongoing research in thermal management and heat dissipation techniques may provide further insights into optimizing the design and efficiency of cooling inserts and heat sinks.


==Original Abstract Submitted==

cooling inserts and adapted heat sinks. in some embodiments, an information handling system (ihs) may include: a first flat surface in parallel with a second flat surface; and a cooling insert disposed between the first and second flat surfaces, the cooling insert comprising: supports coupled to a top portion; and twists coupled between two or more of the supports, where a first twist comprises a cutout.



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