View source for Dell products l.p. (20240341040). PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME simplified abstract

=PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME=


==Organization Name==

[[:Category:dell products l.p.|dell products l.p.]]


[[Category:dell products l.p.]]

==Inventor(s)==

[[:Category:Subramanian Vasudevan of Cedar Park TX (US)|Subramanian Vasudevan of Cedar Park TX (US)]][[Category:Subramanian Vasudevan of Cedar Park TX (US)]]

[[:Category:Edward Rhem of Leander TX (US)|Edward Rhem of Leander TX (US)]][[Category:Edward Rhem of Leander TX (US)]]

[[:Category:Philip Conde of Austin TX (US)|Philip Conde of Austin TX (US)]][[Category:Philip Conde of Austin TX (US)]]

[[:Category:Wallace Ables of Georgetown TX (US)|Wallace Ables of Georgetown TX (US)]][[Category:Wallace Ables of Georgetown TX (US)]]

[[:Category:Edwin C. Tinsley of Austin TX (US)|Edwin C. Tinsley of Austin TX (US)]][[Category:Edwin C. Tinsley of Austin TX (US)]]

==PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240341040 titled 'PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME

==Simplified Explanation==
The patent application discloses board assembly processes using multiple electrically conductive solder types to attach different electronic components to a printed circuit board (PCB).

==Key Features and Innovation==
* Multiple electronic components can be attached to a common PCB using a multiple-step assembly process.
* The assembly process may involve different solder reflow temperatures and multiple solder types with varying melting points.
* Various forms of solder, such as solder paste, wire solder, and ingot solder, can be used.

==Potential Applications==
The technology can be applied in the electronics manufacturing industry for assembling complex electronic devices with different components.

==Problems Solved==
The technology addresses the challenge of attaching various electronic components with different melting points to a single PCB efficiently.

==Benefits==
* Increased flexibility in board assembly processes.
* Enhanced reliability in attaching diverse electronic components.
* Improved efficiency in manufacturing complex electronic devices.

==Commercial Applications==
* Electronics manufacturing for consumer electronics.
* Industrial automation for control systems.
* Telecommunications for networking equipment.

==Questions about Board Assembly Processes==
===How does the use of multiple solder types benefit the board assembly process?===
The use of multiple solder types allows for attaching electronic components with different melting points efficiently, increasing flexibility in the assembly process.

===What are the potential challenges in implementing a multiple-step assembly process with different solder types?===
One potential challenge could be ensuring compatibility between the various solder types and managing the different reflow temperatures effectively.


==Original Abstract Submitted==

board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (pcb). for example, multiple different electronic components may be attached to a common pcb using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). the disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.



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