View source for Category:YANG-CHE CHEN

== YANG-CHE CHEN ==

=== Executive Summary ===
YANG-CHE CHEN is an inventor who has filed 3 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (3 patents). Their most frequent collaborators include [[Category:WEI-YU CHOU|WEI-YU CHOU]] (2 collaborations), [[Category:TSE-WEI LIAO|TSE-WEI LIAO]] (2 collaborations), [[Category:HSIANG-TAI LU|HSIANG-TAI LU]] (2 collaborations).

=== Patent Filing Activity ===
[[File:YANG-CHE_CHEN_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:YANG-CHE_CHEN_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/5223|H01L23/5223]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L28/60|H01L28/60]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L22/20|H01L22/20]] ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
* [[:Category:CPC_G01R31/002|G01R31/002]] (Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere  ({measuring superconductive properties): 1 patents
* [[:Category:CPC_H01L21/4853|H01L21/4853]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
* [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates  (): 1 patents
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L2221/68372|H01L2221/68372]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/56|H01L21/56]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3107|H01L23/3107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/19|H01L2224/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/21|H01L2224/21]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/81|H01L2224/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

=== Companies ===
[[File:YANG-CHE_CHEN_Top_Companies.png|border|800px]]

==== List of Companies ====
* TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: 3 patents

=== Collaborators ===
* [[:Category:WEI-YU CHOU|WEI-YU CHOU]][[Category:WEI-YU CHOU]] (2 collaborations)
* [[:Category:TSE-WEI LIAO|TSE-WEI LIAO]][[Category:TSE-WEI LIAO]] (2 collaborations)
* [[:Category:HSIANG-TAI LU|HSIANG-TAI LU]][[Category:HSIANG-TAI LU]] (2 collaborations)
* [[:Category:CHI-HUI LAI|CHI-HUI LAI]][[Category:CHI-HUI LAI]] (2 collaborations)
* [[:Category:TING-YUAN HUANG|TING-YUAN HUANG]][[Category:TING-YUAN HUANG]] (1 collaborations)
* [[:Category:CHENG-YU HSIEH|CHENG-YU HSIEH]][[Category:CHENG-YU HSIEH]] (1 collaborations)
* [[:Category:CHEN-HUA LIN|CHEN-HUA LIN]][[Category:CHEN-HUA LIN]] (1 collaborations)
* [[:Category:VICTOR CHIANG LIANG|VICTOR CHIANG LIANG]][[Category:VICTOR CHIANG LIANG]] (1 collaborations)
* [[:Category:CHWEN-MING LIU|CHWEN-MING LIU]][[Category:CHWEN-MING LIU]] (1 collaborations)

[[Category:YANG-CHE CHEN]]
[[Category:Inventors]]
[[Category:Inventors filing patents with TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.]]