View source for Category:Ryoma TANABE

== Ryoma TANABE ==

=== Executive Summary ===
Ryoma TANABE is an inventor who has filed 2 patents. Their primary areas of innovation include {Multilayer substrates  (multilayer metallisation on monolayer substrate (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), {characterised by the materials  (materials of the substrates (1 patents), and they have worked with companies such as TOPPAN HOLDINGS INC. (2 patents). Their most frequent collaborators include [[Category:Ryo WARIGAYA|Ryo WARIGAYA]] (1 collaborations), [[Category:Masahito TANABE|Masahito TANABE]] (1 collaborations), [[Category:Masahito Tanabe|Masahito Tanabe]] (1 collaborations).

=== Patent Filing Activity ===
[[File:Ryoma_TANABE_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Ryoma_TANABE_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 1 patents
* [[:Category:CPC_H01L21/4857|H01L21/4857]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
* [[:Category:CPC_H01L23/49866|H01L23/49866]] ({characterised by the materials  (materials of the substrates): 1 patents
* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/16225|H01L2224/16225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/73204|H01L2224/73204]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H05K1/056|H05K1/056]] (Insulated {conductive substrates, e.g. insulated} metal substrate): 1 patents
* [[:Category:CPC_H01L23/142|H01L23/142]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/32|H01L23/32]] (Holders for supporting the complete device in operation, i.e. detachable fixtures  (): 1 patents
* [[:Category:CPC_H05K3/4626|H05K3/4626]] (Manufacturing multilayer circuits): 1 patents

=== Companies ===
[[File:Ryoma_TANABE_Top_Companies.png|border|800px]]

==== List of Companies ====
* TOPPAN HOLDINGS INC.: 2 patents

=== Collaborators ===
* [[:Category:Ryo WARIGAYA|Ryo WARIGAYA]][[Category:Ryo WARIGAYA]] (1 collaborations)
* [[:Category:Masahito TANABE|Masahito TANABE]][[Category:Masahito TANABE]] (1 collaborations)
* [[:Category:Masahito Tanabe|Masahito Tanabe]][[Category:Masahito Tanabe]] (1 collaborations)
* [[:Category:Fusao Takagi|Fusao Takagi]][[Category:Fusao Takagi]] (1 collaborations)

[[Category:Ryoma TANABE]]
[[Category:Inventors]]
[[Category:Inventors filing patents with TOPPAN HOLDINGS INC.]]