View source for Category:Laura Wills Mirkarimi of Sunol CA (US)

== Laura Wills Mirkarimi of Sunol CA (US) ==

=== Executive Summary ===
Laura Wills Mirkarimi of Sunol CA (US) is an inventor who has filed 7 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (7 patents). Their most frequent collaborators include [[Category:Rajesh Katkar of Milpitas CA (US)|Rajesh Katkar of Milpitas CA (US)]] (6 collaborations), [[Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)|Gaius Gillman Fountain, JR. of Youngsville NC (US)]] (5 collaborations), [[Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]] (5 collaborations).

=== Patent Filing Activity ===
[[File:Laura_Wills_Mirkarimi_of_Sunol_CA_(US)_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Laura_Wills_Mirkarimi_of_Sunol_CA_(US)_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 4 patents
* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 2 patents
* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L23/10|H01L23/10]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/76807|H01L21/76807]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
* [[:Category:CPC_H01L21/76816|H01L21/76816]] ({Aspects relating to the layout of the pattern or to the size of vias or trenches  (layout of the interconnections per se): 1 patents
* [[:Category:CPC_H01L2924/01029|H01L2924/01029]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3121|H01L23/3121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/0401|H01L2224/0401]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/3511|H01L2924/3511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/35121|H01L2924/35121]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80948|H01L2224/80948]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L22/34|H01L22/34]] ({Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line  (switching, multiplexing, gating devices): 1 patents
* [[:Category:CPC_H01L21/7685|H01L21/7685]] ({the layer covering a conductive structure  (): 1 patents
* [[:Category:CPC_H01L21/76877|H01L21/76877]] ({Thin films associated with contacts of capacitors}): 1 patents
* [[:Category:CPC_H01L23/53238|H01L23/53238]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/53266|H01L23/53266]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/06|H01L24/06]] ({of a plurality of bonding areas}): 1 patents
* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
* [[:Category:CPC_H01L24/94|H01L24/94]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05147|H01L2224/05147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05181|H01L2224/05181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05184|H01L2224/05184]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08146|H01L2224/08146]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08057|H01L2224/08057]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08147|H01L2224/08147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/76843|H01L21/76843]] ({formed in openings in a dielectric}): 1 patents
* [[:Category:CPC_H01L21/76895|H01L21/76895]] (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
* [[:Category:CPC_H01L23/4824|H01L23/4824]] (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06524|H01L2225/06524]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2225/06544|H01L2225/06544]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

=== Companies ===
[[File:Laura_Wills_Mirkarimi_of_Sunol_CA_(US)_Top_Companies.png|border|800px]]

==== List of Companies ====
* ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 7 patents

=== Collaborators ===
* [[:Category:Rajesh Katkar of Milpitas CA (US)|Rajesh Katkar of Milpitas CA (US)]][[Category:Rajesh Katkar of Milpitas CA (US)]] (6 collaborations)
* [[:Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)|Gaius Gillman Fountain, JR. of Youngsville NC (US)]][[Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)]] (5 collaborations)
* [[:Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]][[Category:Cyprian Emeka Uzoh of San Jose CA (US)]] (5 collaborations)
* [[:Category:Guilian Gao of San Jose CA (US)|Guilian Gao of San Jose CA (US)]][[Category:Guilian Gao of San Jose CA (US)]] (5 collaborations)
* [[:Category:Belgacem Haba of Saratoga CA (US)|Belgacem Haba of Saratoga CA (US)]][[Category:Belgacem Haba of Saratoga CA (US)]] (3 collaborations)
* [[:Category:Thomas Workman of San Jose CA (US)|Thomas Workman of San Jose CA (US)]][[Category:Thomas Workman of San Jose CA (US)]] (2 collaborations)
* [[:Category:Bongsub Lee of Santa Clara CA (US)|Bongsub Lee of Santa Clara CA (US)]][[Category:Bongsub Lee of Santa Clara CA (US)]] (2 collaborations)
* [[:Category:Bongsub Lee of Mountain View CA (US)|Bongsub Lee of Mountain View CA (US)]][[Category:Bongsub Lee of Mountain View CA (US)]] (1 collaborations)
* [[:Category:Gabriel Z. Guevara of San Jose CA (US)|Gabriel Z. Guevara of San Jose CA (US)]][[Category:Gabriel Z. Guevara of San Jose CA (US)]] (1 collaborations)
* [[:Category:Joy Watanabe of Campbell CA (US)|Joy Watanabe of Campbell CA (US)]][[Category:Joy Watanabe of Campbell CA (US)]] (1 collaborations)
* [[:Category:Dominik Suwito of San Jose CA (US)|Dominik Suwito of San Jose CA (US)]][[Category:Dominik Suwito of San Jose CA (US)]] (1 collaborations)
* [[:Category:Jeremy Alfred Theil of Mountain View CA (US)|Jeremy Alfred Theil of Mountain View CA (US)]][[Category:Jeremy Alfred Theil of Mountain View CA (US)]] (1 collaborations)

[[Category:Laura Wills Mirkarimi of Sunol CA (US)]]
[[Category:Inventors]]
[[Category:Inventors filing patents with ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.]]