View source for Category:Kazuma SEKIYA

== Kazuma SEKIYA ==

=== Executive Summary ===
Kazuma SEKIYA is an inventor who has filed 3 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (3 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal (2 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (1 patents), and they have worked with companies such as DISCO CORPORATION (3 patents). Their most frequent collaborators include [[Category:Kazuya HIRATA|Kazuya HIRATA]] (1 collaborations), [[Category:Hayato IGA|Hayato IGA]] (1 collaborations).

=== Patent Filing Activity ===
[[File:Kazuma_SEKIYA_Monthly_Patent_Applications.png|border|800px]]

=== Technology Areas ===
[[File:Kazuma_SEKIYA_Top_Technology_Areas.png|border|800px]]

==== List of Technology Areas ====
* [[:Category:CPC_H01L21/304|H01L21/304]] (Mechanical treatment, e.g. grinding, polishing, cutting {(): 3 patents
* [[:Category:CPC_B23K26/53|B23K26/53]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 2 patents
* [[:Category:CPC_H01L21/8213|H01L21/8213]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
* [[:Category:CPC_H01L21/822|H01L21/822]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
* [[:Category:CPC_B23K2101/40|B23K2101/40]] (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM  (making metal-coated products by extruding metal): 1 patents
* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
* [[:Category:CPC_H01L21/67092|H01L21/67092]] ({Apparatus for mechanical treatment  (or grinding or cutting, see the relevant groups in subclasses): 1 patents

=== Companies ===
[[File:Kazuma_SEKIYA_Top_Companies.png|border|800px]]

==== List of Companies ====
* DISCO CORPORATION: 3 patents

=== Collaborators ===
* [[:Category:Kazuya HIRATA|Kazuya HIRATA]][[Category:Kazuya HIRATA]] (1 collaborations)
* [[:Category:Hayato IGA|Hayato IGA]][[Category:Hayato IGA]] (1 collaborations)

[[Category:Kazuma SEKIYA]]
[[Category:Inventors]]
[[Category:Inventors filing patents with DISCO CORPORATION]]