View source for CHINA TOBACCO ANHUI INDUSTRIAL CO., LTD. (20240334985). CHIP SYSTEM INTEGRATED WITH MCU AND ELECTROMAGNETIC DRIVING simplified abstract

=CHIP SYSTEM INTEGRATED WITH MCU AND ELECTROMAGNETIC DRIVING=


==Organization Name==

[[:Category:CHINA TOBACCO ANHUI INDUSTRIAL CO., LTD.|CHINA TOBACCO ANHUI INDUSTRIAL CO., LTD.]]


[[Category:CHINA TOBACCO ANHUI INDUSTRIAL CO., LTD.]]

==Inventor(s)==

[[:Category:Yanyan Li of Hefei (CN)|Yanyan Li of Hefei (CN)]][[Category:Yanyan Li of Hefei (CN)]]

[[:Category:Jin Zhang of Hefei (CN)|Jin Zhang of Hefei (CN)]][[Category:Jin Zhang of Hefei (CN)]]

[[:Category:Shun Zhou of Hefei (CN)|Shun Zhou of Hefei (CN)]][[Category:Shun Zhou of Hefei (CN)]]

[[:Category:Xiaofeng Wang of Hefei (CN)|Xiaofeng Wang of Hefei (CN)]][[Category:Xiaofeng Wang of Hefei (CN)]]

[[:Category:Xiaoyu Zhang of Hefei (CN)|Xiaoyu Zhang of Hefei (CN)]][[Category:Xiaoyu Zhang of Hefei (CN)]]

[[:Category:Naihong Ding of Hefei (CN)|Naihong Ding of Hefei (CN)]][[Category:Naihong Ding of Hefei (CN)]]

[[:Category:Jingjing Li of Hefei (CN)|Jingjing Li of Hefei (CN)]][[Category:Jingjing Li of Hefei (CN)]]

[[:Category:Wenzheng Li of Hefei (CN)|Wenzheng Li of Hefei (CN)]][[Category:Wenzheng Li of Hefei (CN)]]

[[:Category:Mingjing Guan of Hefei (CN)|Mingjing Guan of Hefei (CN)]][[Category:Mingjing Guan of Hefei (CN)]]

[[:Category:Yun Cao of Hefei (CN)|Yun Cao of Hefei (CN)]][[Category:Yun Cao of Hefei (CN)]]

[[:Category:Huijuan Tian of Hefei (CN)|Huijuan Tian of Hefei (CN)]][[Category:Huijuan Tian of Hefei (CN)]]

==CHIP SYSTEM INTEGRATED WITH MCU AND ELECTROMAGNETIC DRIVING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240334985 titled 'CHIP SYSTEM INTEGRATED WITH MCU AND ELECTROMAGNETIC DRIVING

The abstract describes a chip system integrated with MCU and electromagnetic driving, consisting of various modules such as power management, signal acquisition, controller processing, electromagnetic driving, audio and video output, temperature measurement and control, and GPIO.

* Power management module includes voltage conversion, charging management, battery protection, and power output.
* Signal acquisition module includes voltage, current, temperature, biological signal, and electromagnetic driving load acquisition.
* Controller processing module includes signal processing, transmission, and communication.
* Audio and video output module includes voice playing, LED, and LCD modules.

Potential Applications:
- This technology can be used in various electronic devices requiring precise power management and signal processing.
- It can be applied in medical devices for monitoring biological signals and controlling electromagnetic driving loads.

Problems Solved:
- Efficient power management and signal processing in a compact chip system.
- Accurate acquisition of various signals for better control and monitoring.

Benefits:
- Enhanced performance and reliability in electronic devices.
- Simplified design and integration of multiple modules in a single chip system.

Commercial Applications:
- Potential commercial uses include IoT devices, medical equipment, and consumer electronics.
- Market implications include improved functionality and cost-effectiveness in electronic products.

Prior Art:
- Researchers can explore prior patents related to integrated chip systems with power management and signal acquisition capabilities.

Frequently Updated Research:
- Stay updated on advancements in chip technology, power management, and signal processing for potential improvements in this integrated system.

Questions about the technology:
1. How does the chip system optimize power management and signal acquisition?
2. What are the key advantages of integrating MCU and electromagnetic driving in a single chip system?


==Original Abstract Submitted==

a chip system integrated with mcu and electromagnetic driving includes: a power management module, a signal acquisition module, a controller processing module, an electromagnetic driving module, an audio and video output module, a temperature measurement and control module, and a gpio module; where the power management module includes: a voltage increasing/decreasing conversion module, a charging management module, a battery protection module, and a power output module; the signal acquisition module includes: a voltage acquisition module, a current acquisition module, a temperature acquisition module, a biological signal acquisition module, and an electromagnetic driving load acquisition module; the controller processing module includes: a signal processing module, a signal transmission module, and a signal communication module; and the audio and video output module includes: a voice playing module, an led module, and an lcd module.



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