View source for Boe technology group co., ltd. (20240222580). LIGHT-EMITTING SUBSTRATE, DISPLAY APPARATUS AND TILED DISPLAY APPARATUS simplified abstract

=LIGHT-EMITTING SUBSTRATE, DISPLAY APPARATUS AND TILED DISPLAY APPARATUS=


==Organization Name==

[[:Category:boe technology group co., ltd.|boe technology group co., ltd.]]


[[Category:boe technology group co., ltd.]]

==Inventor(s)==

[[:Category:Yang Yue of Beijing (CN)|Yang Yue of Beijing (CN)]][[Category:Yang Yue of Beijing (CN)]]

[[:Category:Wei Wang of Beijing (CN)|Wei Wang of Beijing (CN)]][[Category:Wei Wang of Beijing (CN)]]

[[:Category:Ruoyu Ma of Beijing (CN)|Ruoyu Ma of Beijing (CN)]][[Category:Ruoyu Ma of Beijing (CN)]]

[[:Category:Shi Shu of Beijing (CN)|Shi Shu of Beijing (CN)]][[Category:Shi Shu of Beijing (CN)]]

[[:Category:Yong Yu of Beijing (CN)|Yong Yu of Beijing (CN)]][[Category:Yong Yu of Beijing (CN)]]

[[:Category:Xiang Li of Beijing (CN)|Xiang Li of Beijing (CN)]][[Category:Xiang Li of Beijing (CN)]]

[[:Category:Shaohui Li of Beijing (CN)|Shaohui Li of Beijing (CN)]][[Category:Shaohui Li of Beijing (CN)]]

[[:Category:Qi Yao of Beijing (CN)|Qi Yao of Beijing (CN)]][[Category:Qi Yao of Beijing (CN)]]

[[:Category:Shipei Li of Beijing (CN)|Shipei Li of Beijing (CN)]][[Category:Shipei Li of Beijing (CN)]]

[[:Category:Renquan Gu of Beijing (CN)|Renquan Gu of Beijing (CN)]][[Category:Renquan Gu of Beijing (CN)]]

[[:Category:Wenqu Liu of Beijing (CN)|Wenqu Liu of Beijing (CN)]][[Category:Wenqu Liu of Beijing (CN)]]

[[:Category:Chuanxiang Xu of Beijing (CN)|Chuanxiang Xu of Beijing (CN)]][[Category:Chuanxiang Xu of Beijing (CN)]]

==LIGHT-EMITTING SUBSTRATE, DISPLAY APPARATUS AND TILED DISPLAY APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240222580 titled 'LIGHT-EMITTING SUBSTRATE, DISPLAY APPARATUS AND TILED DISPLAY APPARATUS

The abstract describes a light-emitting substrate with specific layers and bonding regions for improved functionality.

* The substrate includes a first metal layer with bonding electrodes, a first insulating layer, a second metal layer with bonding electrodes, and a conductive adhesive in the bonding region.
* The first insulating layer is positioned closer to the edge than the bonding electrodes, enhancing the substrate's structural integrity.
* The ratio of the dimension of the insulating layer to the bonding electrode is carefully controlled for optimal performance.

Potential Applications:
- LED displays
- Lighting panels
- Electronic signage

Problems Solved:
- Enhanced bonding strength
- Improved electrical conductivity
- Structural stability

Benefits:
- Increased durability
- Enhanced electrical performance
- Improved overall functionality

Commercial Applications:
Title: Advanced Light-Emitting Substrate for High-Performance Displays
This technology can be utilized in the manufacturing of LED displays, lighting panels, and electronic signage, catering to industries such as advertising, entertainment, and consumer electronics.

Prior Art:
Readers can explore prior patents related to light-emitting substrates, metal layers, and conductive adhesives to gain a deeper understanding of the technological advancements in this field.

Frequently Updated Research:
Stay updated on the latest developments in light-emitting substrates, materials science, and display technologies to leverage cutting-edge innovations in product design and manufacturing.

Questions about Light-Emitting Substrates:
1. How does the positioning of the insulating layer impact the overall performance of the substrate?
The insulating layer's proximity to the edge enhances structural stability and bonding strength, crucial for the substrate's functionality.

2. What role does the conductive adhesive play in the bonding region?
The conductive adhesive covers portions of the bonding electrodes, ensuring efficient electrical conductivity and secure bonding between layers.


==Original Abstract Submitted==

a light-emitting substrate includes a substrate, a first metal layer, a first insulating layer, a second metal layer and a conductive adhesive. a bonding region is proximate to a selected side edge of a first surface of the substrate. the first metal layer on the first surface includes first bonding electrodes. the first insulating layer is on the first metal layer, and a border thereof proximate to the edge is closer to the edge than a border of the first bonding electrodes facing the edge. the second metal layer includes second bonding electrodes. the conductive adhesive in the bonding region covers portions of the second bonding electrodes. a ratio of a dimension of an edge portion of the first insulating layer in a second direction to a dimension of a first bonding electrode in same direction is greater than or equal to ⅕ and less than or equal to �.



[[Category:H01L33/62]]
[[Category:H01L25/075]]
[[Category:CPC_H01L33/62]]