View source for BAE Systems Information and Electronic Systems Integration Inc. (20240250430). ADDITIVELY MANUFACTURED MODULAR APERTURE (AMMA) STACKED PATCH ANTENNA simplified abstract

=ADDITIVELY MANUFACTURED MODULAR APERTURE (AMMA) STACKED PATCH ANTENNA=


==Organization Name==

[[:Category:BAE Systems Information and Electronic Systems Integration Inc.|BAE Systems Information and Electronic Systems Integration Inc.]]


[[Category:BAE Systems Information and Electronic Systems Integration Inc.]]

==Inventor(s)==

[[:Category:Jean L. Kubwimana of Merrimack NH (US)|Jean L. Kubwimana of Merrimack NH (US)]][[Category:Jean L. Kubwimana of Merrimack NH (US)]]

[[:Category:Alexander D. Johnson of Waltham MA (US)|Alexander D. Johnson of Waltham MA (US)]][[Category:Alexander D. Johnson of Waltham MA (US)]]

[[:Category:Jacob Tamasy of Nashua NH (US)|Jacob Tamasy of Nashua NH (US)]][[Category:Jacob Tamasy of Nashua NH (US)]]

[[:Category:James F. Fung of Manchester NH (US)|James F. Fung of Manchester NH (US)]][[Category:James F. Fung of Manchester NH (US)]]

[[:Category:Matthew J. Ney of Derry NH (US)|Matthew J. Ney of Derry NH (US)]][[Category:Matthew J. Ney of Derry NH (US)]]

==ADDITIVELY MANUFACTURED MODULAR APERTURE (AMMA) STACKED PATCH ANTENNA - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240250430 titled 'ADDITIVELY MANUFACTURED MODULAR APERTURE (AMMA) STACKED PATCH ANTENNA

The abstract describes an antenna assembly consisting of a first dielectric material, a ground plane, and two or more patch antennas above the ground plane. The ground plane has two non-intersecting aperture slots, and a second dielectric material separates the patch antennas from the ground plane. The components are manufactured using additive manufacturing techniques, with the second dielectric material being dielectric foam.

* The antenna assembly includes a ground plane with non-intersecting aperture slots.
* Two or more patch antennas are positioned above the ground plane.
* Additive manufacturing techniques are used to manufacture the ground plane and patch antennas.
* Dielectric foam is used as the second dielectric material to support the patch antennas.
* The first dielectric material is a printed circuit board (PCB).

Potential Applications:
- Telecommunications
- Satellite communications
- Wireless networking

Problems Solved:
- Efficient signal transmission and reception
- Space-saving design
- Improved antenna performance

Benefits:
- Enhanced signal quality
- Compact and lightweight design
- Cost-effective manufacturing process

Commercial Applications:
Title: Innovative Antenna Assembly for Enhanced Signal Transmission
This technology can be utilized in various industries such as telecommunications, satellite communications, and wireless networking. The compact and efficient design offers improved signal quality and performance, making it ideal for commercial applications requiring reliable communication systems.

Questions about the technology:
1. How does the use of dielectric foam benefit the antenna assembly?
2. What are the advantages of utilizing additive manufacturing techniques in antenna production?


==Original Abstract Submitted==

an antenna assembly includes a first dielectric material, a ground plane above the first dielectric material, and two or more patch antennas above the ground plane. in an example, the ground plane has a first aperture slot, and a second aperture slot that is non-intersecting with the first aperture slot. the antenna assembly further includes a second dielectric material separating the two or more patch antennas from the ground plane. in an example, the first dielectric material comprises a printed circuit board (pcb). in some examples, the ground plane and the two or more patch antennas are manufactured using additive manufacturing techniques (such as three-dimensional printing techniques), and in some such examples, the second dielectric material includes dielectric foam. for example, the dielectric foam supports the two or more patch antennas above the ground plane.



[[Category:H01Q9/04]]
[[Category:H01Q1/48]]
[[Category:H01Q21/06]]
[[Category:CPC_H01Q9/0414]]