View source for Applied materials, inc. (20250114909). COLD LIQUID POLISHING CONTROL

=COLD LIQUID POLISHING CONTROL=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Priscilla Diep Larosa of San Jose CA US|Priscilla Diep Larosa of San Jose CA US]][[Category:Priscilla Diep Larosa of San Jose CA US]]

[[:Category:Chih Chung Chou of San Jose CA US|Chih Chung Chou of San Jose CA US]][[Category:Chih Chung Chou of San Jose CA US]]

[[:Category:Haosheng Wu of San Jose CA US|Haosheng Wu of San Jose CA US]][[Category:Haosheng Wu of San Jose CA US]]

[[:Category:Taketo Sekine of Cupertino CA US|Taketo Sekine of Cupertino CA US]][[Category:Taketo Sekine of Cupertino CA US]]

[[:Category:Chen-Wei Chang of San Jose CA US|Chen-Wei Chang of San Jose CA US]][[Category:Chen-Wei Chang of San Jose CA US]]

[[:Category:Elton Zhong of San Jose CA US|Elton Zhong of San Jose CA US]][[Category:Elton Zhong of San Jose CA US]]

[[:Category:Jianshe Tang of San Jose CA US|Jianshe Tang of San Jose CA US]][[Category:Jianshe Tang of San Jose CA US]]

[[:Category:Songling Shin of Sunnyvale CA US|Songling Shin of Sunnyvale CA US]][[Category:Songling Shin of Sunnyvale CA US]]

==COLD LIQUID POLISHING CONTROL==


This abstract first appeared for US patent application 20250114909 titled 'COLD LIQUID POLISHING CONTROL

==Original Abstract Submitted==

a chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.



[[Category:B24B55/03]]
[[Category:B24B37/015]]
[[Category:B24B37/20]]
[[Category:CPC_B24B55/03]]