View source for Applied materials, inc. (20240408712). CERAMIC COOLING BASE

=CERAMIC COOLING BASE=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Andreas Schmid of Santa Clara CA (US)|Andreas Schmid of Santa Clara CA (US)]][[Category:Andreas Schmid of Santa Clara CA (US)]]

[[:Category:Stephen Prouty of Santa Clara CA (US)|Stephen Prouty of Santa Clara CA (US)]][[Category:Stephen Prouty of Santa Clara CA (US)]]

[[:Category:Alvaro Garcia De Gorordo of Santa Clara CA (US)|Alvaro Garcia De Gorordo of Santa Clara CA (US)]][[Category:Alvaro Garcia De Gorordo of Santa Clara CA (US)]]

[[:Category:Andrew Antoine Noujaim of Santa Clara CA (US)|Andrew Antoine Noujaim of Santa Clara CA (US)]][[Category:Andrew Antoine Noujaim of Santa Clara CA (US)]]

==CERAMIC COOLING BASE==


This abstract first appeared for US patent application 20240408712 titled 'CERAMIC COOLING BASE




==Original Abstract Submitted==

substrate supports and related components including additive manufacturing processes are disclosed. one substrate support assembly includes an electrostatic chuck; and a cooling base having a first surface that is bonded to a first surface of the electrostatic chuck with a metallic bonding material, the cooling base comprising: a ceramic body having a coefficient of thermal expansion substantially the same as the electrostatic chuck; one or more cooling channels formed within the ceramic body; and one or more conductive zones extending through the ceramic body from the first surface to a second surface on an opposite side of the cooling base.



[[Category:B23Q11/10]]
[[Category:B23Q3/15]]
[[Category:F28F13/00]]
[[Category:H02N13/00]]
[[Category:CPC_B23Q11/10]]