View source for Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract

=Method of Multi-layer Die Stacking with Die-to-Wafer Bonding=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Guan Huei See of Singapore (SG)|Guan Huei See of Singapore (SG)]][[Category:Guan Huei See of Singapore (SG)]]

[[:Category:Jinho An of San Jose CA (US)|Jinho An of San Jose CA (US)]][[Category:Jinho An of San Jose CA (US)]]

[[:Category:Arvind Sundarrajan of Singapore (SG)|Arvind Sundarrajan of Singapore (SG)]][[Category:Arvind Sundarrajan of Singapore (SG)]]

==Method of Multi-layer Die Stacking with Die-to-Wafer Bonding - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240266319 titled 'Method of Multi-layer Die Stacking with Die-to-Wafer Bonding

'''Simplified Explanation:'''
The patent application describes a method of die stacking with die-to-wafer bonding, involving bonding dies to a substrate, thinning the dies, passivating them, filling gaps with a fill material, and forming conductive vias.

* Bonding multiple dies to a substrate using a hybrid bonding process.
* Thinning the bonded dies through a selective silicon thinning process.
* Passivating the thinned dies for protection.
* Filling gaps between thinned dies with a fill material to create a layer.
* Creating conductive vias through the layer to the substrate.

'''Potential Applications:'''
This technology can be applied in semiconductor manufacturing, integrated circuit packaging, and microelectronics industries for creating compact and high-performance electronic devices.

'''Problems Solved:'''
This method addresses the challenges of achieving high-density packaging, improving thermal performance, and enhancing electrical connectivity in stacked die configurations.

'''Benefits:'''
The benefits of this method include increased device integration, improved signal transmission, enhanced thermal dissipation, and overall miniaturization of electronic systems.

'''Commercial Applications:'''
The technology can be utilized in the production of advanced smartphones, tablets, wearables, IoT devices, and other compact electronic gadgets requiring efficient die stacking solutions.

'''Prior Art:'''
Readers interested in prior art related to die stacking methods with die-to-wafer bonding can explore research papers, patents, and industry publications on semiconductor packaging technologies.

'''Frequently Updated Research:'''
Stay updated on the latest advancements in die stacking techniques, hybrid bonding processes, and semiconductor packaging innovations to enhance your understanding of this technology.

'''Questions about Die Stacking with Die-to-Wafer Bonding:'''
1. How does die-to-wafer bonding differ from other die stacking methods?
2. What are the key considerations for selecting the fill material in die stacking processes?

By addressing these questions, readers can gain a deeper insight into the intricacies of die stacking with die-to-wafer bonding and its applications in the semiconductor industry.


==Original Abstract Submitted==

embodiments of methods of die stacking are provided herein. in some embodiments, a method of die stacking with die-to-wafer bonding includes: bonding a plurality of first dies to a substrate via a hybrid bonding process; performing a selective silicon (si) thinning process to reduce a thickness of the plurality of first dies that are bonded to form a plurality of thinned first dies; passivating the plurality of thinned first dies to form a plurality of passivated thinned first dies to protect the plurality of thinned first dies; filling gaps between adjacent dies of the plurality of thinned first dies with a first fill material, wherein the plurality of passivated thinned first dies and the first fill material together form a first layer; and forming a plurality of first conductive vias through the first layer to the substrate.



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