View source for Applied materials, inc. (20240266206). LIFT PIN ASSEMBLY simplified abstract

=LIFT PIN ASSEMBLY=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Yogananda Sarode Vishwanath of Bangalore (IN)|Yogananda Sarode Vishwanath of Bangalore (IN)]][[Category:Yogananda Sarode Vishwanath of Bangalore (IN)]]

[[:Category:Anand Kumar of Bangalore (IN)|Anand Kumar of Bangalore (IN)]][[Category:Anand Kumar of Bangalore (IN)]]

==LIFT PIN ASSEMBLY - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240266206 titled 'LIFT PIN ASSEMBLY

'''Simplified Explanation:'''
The patent application describes apparatuses for substrate transfer, specifically focusing on a lift pin assembly that includes a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide and the purge cylinder work together to reduce particle deposition on the substrate during transfer.

* The lift pin assembly consists of a lift pin, a purge cylinder, and a lift pin guide.
* The lift pin guide and the purge cylinder have a passage formed through them where the lift pin is placed.
* The purge cylinder features one or more nozzles that direct gas flow radially inward into a portion of the passage, preventing particle deposition on the substrate.
* The nozzles are positioned radially outward from the lift pin, ensuring efficient gas flow.
* By preventing contact between the lift pin and the support assembly, the purge cylinder effectively reduces particle deposition on the substrate.

'''Potential Applications:'''
This technology can be applied in semiconductor manufacturing, solar panel production, and other industries where precise substrate handling is crucial to prevent contamination.

'''Problems Solved:'''
The technology addresses the issue of particle deposition on substrates during transfer, ensuring high-quality manufacturing processes and reducing the need for costly cleaning procedures.

'''Benefits:'''
- Improved substrate transfer efficiency
- Reduced particle contamination on substrates
- Enhanced overall product quality
- Cost savings from reduced cleaning requirements

'''Commercial Applications:'''
Title: Advanced Substrate Transfer Technology for Semiconductor Manufacturing
This technology can be utilized in semiconductor fabrication facilities to enhance production efficiency, reduce contamination risks, and improve product quality. The market implications include increased competitiveness, higher yield rates, and improved customer satisfaction.

'''Questions about Substrate Transfer Technology:'''
1. How does the purge cylinder prevent particle deposition on the substrate during transfer?
The purge cylinder directs gas flow radially inward into the passage, creating a barrier between the lift pin and the support assembly, thus reducing particle deposition.

2. What industries can benefit from the use of this substrate transfer technology?
Semiconductor manufacturing, solar panel production, and other industries requiring precise substrate handling can benefit from this technology.


==Original Abstract Submitted==

apparatuses for substrate transfer are provided. a lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. the lift pin guide is disposed adjacent the purge cylinder. the lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. the purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. the one or more nozzles are disposed radially outward from the lift pin. the purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.



[[Category:H01L21/687]]
[[Category:C23C16/44]]
[[Category:H01J37/32]]
[[Category:H01L21/67]]
[[Category:H01L21/683]]
[[Category:CPC_H01L21/68742]]