View source for Applied materials, inc. (20240266200). Electrostatic Chuck simplified abstract

=Electrostatic Chuck=


==Organization Name==

[[:Category:applied materials, inc.|applied materials, inc.]]


[[Category:applied materials, inc.]]

==Inventor(s)==

[[:Category:Sarath Babu of Singapore (RS)|Sarath Babu of Singapore (RS)]][[Category:Sarath Babu of Singapore (RS)]]

[[:Category:Mukund Sundararajan of Bangalore (IN)|Mukund Sundararajan of Bangalore (IN)]][[Category:Mukund Sundararajan of Bangalore (IN)]]

[[:Category:Cheng-Hsiung Tsai of Cupertino CA (US)|Cheng-Hsiung Tsai of Cupertino CA (US)]][[Category:Cheng-Hsiung Tsai of Cupertino CA (US)]]

[[:Category:Ananthkrishna Jupudi of Singapore (SG)|Ananthkrishna Jupudi of Singapore (SG)]][[Category:Ananthkrishna Jupudi of Singapore (SG)]]

[[:Category:Ross Marshall of Campbell CA (US)|Ross Marshall of Campbell CA (US)]][[Category:Ross Marshall of Campbell CA (US)]]

==Electrostatic Chuck - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240266200 titled 'Electrostatic Chuck

The abstract describes an electrostatic chuck assembly with a body recess and a heat transfer plate. The heat transfer plate has an upper surface, a lower surface, a first opening, and a second opening. An RF transmission tube transfers RF power to the lower surface of the heat transfer plate. A puck is bonded to the upper surface of the heat transfer plate, and there are first and second chucking electrodes in the first and second openings, transferring a chucking voltage to the puck.

* The electrostatic chuck assembly includes a heat transfer plate with upper and lower surfaces, first and second openings, and a puck bonded to the upper surface.
* An RF transmission tube transfers RF power to the lower surface of the heat transfer plate.
* Chucking electrodes in the first and second openings transfer a chucking voltage to the puck.
* The assembly is designed to securely hold objects in place using electrostatic forces.
* The heat transfer plate helps in dissipating heat generated during operation, maintaining a stable temperature for the chuck assembly.

Potential Applications:
- Semiconductor manufacturing processes
- Thin film deposition
- Wafer bonding

Problems Solved:
- Securely holding objects in place during processing
- Efficient heat dissipation to prevent overheating

Benefits:
- Improved stability and precision in manufacturing processes
- Enhanced heat dissipation capabilities
- Increased productivity and efficiency in semiconductor manufacturing

Commercial Applications:
Title: Advanced Electrostatic Chuck Assembly for Semiconductor Manufacturing
This technology can be used in semiconductor fabrication facilities to enhance the precision and efficiency of manufacturing processes. It can also find applications in other industries requiring precise and stable object positioning.

Questions about Electrostatic Chuck Assembly:
1. How does the heat transfer plate contribute to the performance of the electrostatic chuck assembly?
The heat transfer plate helps in dissipating heat generated during operation, maintaining a stable temperature for the chuck assembly.

2. What role do the chucking electrodes play in the electrostatic chuck assembly?
The chucking electrodes transfer a chucking voltage to the puck, ensuring secure holding of objects in place during processing.


==Original Abstract Submitted==

an electrostatic chuck assembly including a body including a body recess and a heat transfer plate disposed in the body recess, wherein the heat transfer plate includes an upper surface, a lower surface, a first opening, and a second opening. the electrostatic chuck assembly further includes an rf transmission tube configured to transfer rf power to the lower surface of the heat transfer plate. the electrostatic chuck assembly further includes a puck bonded to the upper surface of the heat transfer plate. the electrostatic chuck assembly further includes a first chucking electrode disposed in the first opening and a second chucking electrode is disposed in the second opening, wherein the first and second chucking electrodes are configured to transfer a chucking voltage to the puck.



[[Category:H01L21/683]]
[[Category:H01L21/67]]
[[Category:CPC_H01L21/6833]]