View source for Apple inc. (20250112383). EXTENDED-RANGE HIGH-SPEED INTERCONNECT

=EXTENDED-RANGE HIGH-SPEED INTERCONNECT=


==Organization Name==

[[:Category:apple inc.|apple inc.]]


[[Category:apple inc.]]

==Inventor(s)==

[[:Category:Steven Webster of Singapore SG|Steven Webster of Singapore SG]][[Category:Steven Webster of Singapore SG]]

[[:Category:Henry M. Daghighian of Cupertino CA US|Henry M. Daghighian of Cupertino CA US]][[Category:Henry M. Daghighian of Cupertino CA US]]

[[:Category:Jee Tung Tan of Singapore SG|Jee Tung Tan of Singapore SG]][[Category:Jee Tung Tan of Singapore SG]]

[[:Category:Peter Chin Ting Soon of Singapore SG|Peter Chin Ting Soon of Singapore SG]][[Category:Peter Chin Ting Soon of Singapore SG]]

==EXTENDED-RANGE HIGH-SPEED INTERCONNECT==


This abstract first appeared for US patent application 20250112383 titled 'EXTENDED-RANGE HIGH-SPEED INTERCONNECT

==Original Abstract Submitted==

examples can provide extended-range high-speed interconnect by providing microcoax cables in a hybrid flexible circuit board, which can be referred to as a hybrid flex or microcoax flex. this hybrid flex can be used to convey signals an extended distance within an electronic device. multiple signals can be conveyed using corresponding microcoax cables. the microcoax cables can include a center conductor, an insulating layer, and an outside shield layer. the cables can be held in position in the hybrid flex relative to each other by a polyimide or other insulative layer. copper layers can be provided on either or both the top and bottom of the polyimide or other insulative layer. additional conductors can be embedded in the polyimide other insulative layer to convey power and ground. the microcoax and other conductors can be soldered to a flexible circuit board or other substrate using jet soldering.



[[Category:H01R12/62]]
[[Category:H01R12/77]]
[[Category:H01R13/6592]]
[[Category:H01R24/50]]
[[Category:CPC_H01R12/62]]