View source for Apple inc. (20250072134). Electronic Devices Having Compact Optical Modules

=Electronic Devices Having Compact Optical Modules=


==Organization Name==

[[:Category:apple inc.|apple inc.]]


[[Category:apple inc.]]

==Inventor(s)==

[[:Category:Dong Zheng of Los Altos CA (US)|Dong Zheng of Los Altos CA (US)]][[Category:Dong Zheng of Los Altos CA (US)]]

[[:Category:Kenneth J. Vampola of Los Altos CA (US)|Kenneth J. Vampola of Los Altos CA (US)]][[Category:Kenneth J. Vampola of Los Altos CA (US)]]

[[:Category:Seshasayee Gaddamraja of Santa Clara CA (US)|Seshasayee Gaddamraja of Santa Clara CA (US)]][[Category:Seshasayee Gaddamraja of Santa Clara CA (US)]]

[[:Category:Emma C. Thomson of San Jose CA (US)|Emma C. Thomson of San Jose CA (US)]][[Category:Emma C. Thomson of San Jose CA (US)]]

==Electronic Devices Having Compact Optical Modules==


This abstract first appeared for US patent application 20250072134 titled 'Electronic Devices Having Compact Optical Modules

==Original Abstract Submitted==

ambient light sensor modules may be formed using a wafer-level process in which a filter and a diffuser are stacked on a silicon substrate or a combination substrate that includes multiple photosensors. the stack may be diced, filled with opaque material, and diced again to form multiple ambient light sensor modules. the resulting modules may include a silicon substrate with a photosensor and through-silicon vias, a filter on the silicon substrate, and a diffuser coupled to the filter. there may be an air gap between a portion of the diffuser and the photosensor. the air gap may be formed from a recess in the diffuser or from spacers between the filter and the diffuser. alternatively, the diffuser may be applied as a coating on the filter. by forming the ambient light sensor modules at the wafer level, the modules may have smaller footprints and/or volumes.



[[Category:H01L27/146]]
[[Category:CPC_H01L27/14645]]