View source for Apple inc. (20240243113). THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD simplified abstract

=THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD=


==Organization Name==

[[:Category:apple inc.|apple inc.]]


[[Category:apple inc.]]

==Inventor(s)==

[[:Category:Sidharth S. Dalmia of San Jose CA (US)|Sidharth S. Dalmia of San Jose CA (US)]][[Category:Sidharth S. Dalmia of San Jose CA (US)]]

==THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240243113 titled 'THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD

The abstract describes a system-in-package for an electronic device with reduced thickness, consisting of a stepped mold, an insulation film substrate, at least one processor die, and at least one passive element. The components are interconnected via connectors, allowing for a compact design.

* The system-in-package includes a stepped mold, insulation film substrate, processor die, and passive element.
* The insulation film substrate is connected to a multi-layer board via a first plurality of connectors.
* The processor die and passive element are integrated into the stepped mold and stacked onto the insulation film substrate using connectors.
* This design allows for a reduced thickness electronic device with efficient component integration.

Potential Applications:
- Mobile devices
- Wearable technology
- IoT devices

Problems Solved:
- Reducing the thickness of electronic devices
- Efficient component integration
- Enhanced performance in compact devices

Benefits:
- Compact design
- Improved performance
- Enhanced functionality in smaller devices

Commercial Applications:
Title: "Compact System-in-Package Technology for Electronic Devices"
This technology can be used in smartphones, smartwatches, and other portable electronic devices to create thinner and more efficient products, catering to the demand for sleek and powerful gadgets in the market.

Questions about the technology:
1. How does the integration of components in a stepped mold contribute to reducing the thickness of electronic devices?
- The integration of components in a stepped mold allows for a more compact design, optimizing space and reducing the overall thickness of the device.

2. What are the advantages of using an insulation film substrate in the system-in-package design?
- The insulation film substrate provides a lightweight and flexible base for integrating components, enhancing the overall efficiency and performance of the electronic device.


==Original Abstract Submitted==

a system-in-package for an electronic device with a reduced thickness is presented herein. the system-in-package includes a stepped mold, an insulation film substrate, at least one processor die, and at least one passive element. the insulation film substrate is connected to a multi-layer board via a first plurality of connectors. the at least one processor die is integrated into the stepped mold and stacked onto the insulation film substrate via a second plurality of connectors. the at least one passive element is integrated into the stepped mold and stacked onto the insulation film substrate.



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