View source for ACM RESEARCH (SHANGHAI), INC. Patent Application Trends in 2024

== ACM RESEARCH (SHANGHAI), INC. Patent Filing Activity ==
== ACM RESEARCH (SHANGHAI), INC. patent applications in 2024 ==
[[File:ACM RESEARCH (SHANGHAI), INC. Monthly Patent Applications 2024 - Up to June 2024.png|border|800px]]
== Top 10 Technology Areas ==
[[File:ACM RESEARCH (SHANGHAI), INC. Top Technology Areas 2024 - Up to June 2024.png|border|800px|ACM RESEARCH (SHANGHAI), INC. Top Technology Areas 2024 - Up to June 2024]]

* [[:Category:CPC_C25D17/001|C25D17/001]] ({Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells})
** Count: 3 patents
** Example: [[20240018681. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D21/12|C25D21/12]] (Process control or regulation  (controlling or regulating in general)
** Count: 3 patents
** Example: [[20240018681. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D17/002|C25D17/002]] ({Cell separation, e.g. membranes, diaphragms})
** Count: 2 patents
** Example: [[20240018681. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D21/10|C25D21/10]] (Agitating of electrolytes; Moving of racks)
** Count: 2 patents
** Example: [[20240218551. ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR SUBSTRATE simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D7/12|C25D7/12]] (Semiconductors)
** Count: 2 patents
** Example: [[20240026561. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_H01L21/68764|H01L21/68764]] (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks)
** Count: 1 patents
** Example: [[20240105496. SUBSTRATE SUPPORTING APPARATUS simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_H01L21/6708|H01L21/6708]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se)
** Count: 1 patents
** Example: [[20240105496. SUBSTRATE SUPPORTING APPARATUS simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_H01L21/6715|H01L21/6715]] ({Apparatus for applying a liquid, a resin, an ink or the like  ()
** Count: 1 patents
** Example: [[20240105496. SUBSTRATE SUPPORTING APPARATUS simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_H01L21/68735|H01L21/68735]] (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks)
** Count: 1 patents
** Example: [[20240105496. SUBSTRATE SUPPORTING APPARATUS simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_H01L21/68742|H01L21/68742]] (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks)
** Count: 1 patents
** Example: [[20240105496. SUBSTRATE SUPPORTING APPARATUS simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
== Emerging Technology Areas ==
[[File:ACM RESEARCH (SHANGHAI), INC. Top Emerging Technology Areas 2024 - Up to June 2024.png|border|800px|ACM RESEARCH (SHANGHAI), INC. Top Emerging Technology Areas 2024 - Up to June 2024]]

* [[:Category:CPC_H01L21/2885|H01L21/2885]] (from a liquid, e.g. electrolytic deposition)
** Count: 1 patents
** Example: [[20240026561. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D17/10|C25D17/10]] (Electrodes {, e.g. composition, counter electrode})
** Count: 1 patents
** Example: [[20240026561. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D17/005|C25D17/005]] ({Contacting devices})
** Count: 1 patents
** Example: [[20240218551. ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR SUBSTRATE simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D17/06|C25D17/06]] (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR)
** Count: 1 patents
** Example: [[20240035189. CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING DEVICE simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D7/123|C25D7/123]] ({Semiconductors first coated with a seed layer or a conductive layer})
** Count: 1 patents
** Example: [[20240018681. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_C25D5/18|C25D5/18]] (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR)
** Count: 1 patents
** Example: [[20240018681. PLATING APPARATUS AND PLATING METHOD simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_F04B23/04|F04B23/04]] (POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS  (machines for liquids, or pumps, of rotary-piston or oscillating-piston type)
** Count: 1 patents
** Example: [[20240207760. METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_B08B2203/007|B08B2203/007]] (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL  (brushes)
** Count: 1 patents
** Example: [[20240207760. METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_H01L21/67253|H01L21/67253]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se)
** Count: 1 patents
** Example: [[20240207760. METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
* [[:Category:CPC_H01L21/67092|H01L21/67092]] ({Apparatus for mechanical treatment  (or grinding or cutting, see the relevant groups in subclasses)
** Count: 1 patents
** Example: [[20240207760. METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE simplified abstract (ACM RESEARCH (SHANGHAI), INC.)]]
== Top Inventors ==
[[File:ACM RESEARCH (SHANGHAI), INC. Top Inventors 2024 - Up to June 2024.png|border|800px|ACM RESEARCH (SHANGHAI), INC. Top Inventors 2024 - Up to June 2024]]
* [[:Category:Hui Wang|Hui Wang]] (8 patents)
* [[:Category:Jian Wang|Jian Wang]] (6 patents)
* [[:Category:Hongchao Yang|Hongchao Yang]] (4 patents)
* [[:Category:Zhaowei Jia|Zhaowei Jia]] (4 patents)
* [[:Category:Shena Jia|Shena Jia]] (2 patents)
* [[:Category:Fuping Chen|Fuping Chen]] (2 patents)
* [[:Category:Jun Wang|Jun Wang]] (2 patents)
* [[:Category:Yinuo Jin|Yinuo Jin]] (2 patents)
* [[:Category:Feng Liu|Feng Liu]] (1 patent)
* [[:Category:Xiaofeng Tao|Xiaofeng Tao]] (1 patent)
== Patent Categories ==
[[File:ACM RESEARCH (SHANGHAI), INC. Patent Categories 2024 - Up to June 2024.png|border|500px|ACM RESEARCH (SHANGHAI), INC. Patent Categories 2024 - Up to June 2024]]

== Geographical Distribution of Inventors ==
[[File:ACM RESEARCH (SHANGHAI), INC. Inventor Countries 2024 - Up to June 2024.png|border|800px|ACM RESEARCH (SHANGHAI), INC. Inventor Countries 2024 - Up to June 2024]]

== Geographical Distribution of US Inventors ==
[[File:ACM RESEARCH (SHANGHAI), INC. Inventor States 2024 - Up to June 2024.png|border|800px|ACM RESEARCH (SHANGHAI), INC. Inventor States 2024 - Up to June 2024]]

[[Category:ACM RESEARCH (SHANGHAI), INC.]]
[[Category:Companies]]
[[Category:CPC_H01L21/68764]]
[[Category:CPC_H01L21/6708]]
[[Category:CPC_H01L21/6715]]
[[Category:CPC_H01L21/68735]]
[[Category:CPC_H01L21/68742]]
[[Category:CPC_G03F7/7075]]
[[Category:CPC_G03F7/168]]
[[Category:CPC_G03F7/70533]]
[[Category:CPC_G03F7/70825]]
[[Category:CPC_G03F7/70933]]
[[Category:CPC_B01D19/0036]]
[[Category:CPC_B01D19/00]]
[[Category:CPC_B01D19/0031]]
[[Category:CPC_B08B3/041]]
[[Category:CPC_B08B3/08]]
[[Category:CPC_B08B3/10]]
[[Category:CPC_B08B3/12]]
[[Category:CPC_B08B7/04]]
[[Category:CPC_F04B15/04]]
[[Category:CPC_F04B23/00]]
[[Category:CPC_H01L21/02052]]
[[Category:CPC_H01L21/02057]]
[[Category:CPC_H01L21/67017]]
[[Category:CPC_H01L21/67051]]
[[Category:CPC_H01L21/67092]]
[[Category:CPC_H01L21/67253]]
[[Category:CPC_B08B2203/007]]
[[Category:CPC_F04B23/04]]
[[Category:CPC_C25D5/18]]
[[Category:CPC_C25D7/123]]
[[Category:CPC_C25D17/001]]
[[Category:CPC_C25D17/002]]
[[Category:CPC_C25D21/12]]
[[Category:CPC_C25D17/06]]
[[Category:CPC_C25D17/005]]
[[Category:CPC_C25D21/10]]
[[Category:CPC_C25D17/10]]
[[Category:CPC_C25D7/12]]
[[Category:CPC_H01L21/2885]]
[[Category:Patent Trends by Company in 2024]]