View source for 3D Printing patent applications on 11th Oct 2024

=Patent Applications for 3D Printing on 11th Oct 2024=

Number of patent applications containing '3D Printing' or its variations: 22

[[Dalian Polytechnic University (20240334958). Method for Preparing Easy-to-Swallow Composite Gel based on High-pressure Shear Induction simplified abstract]]

Organization: Dalian Polytechnic University

Inventor(s): Xiuping DONG of Dalian  (CN) for Dalian Polytechnic University, Yisha Xie of Dalian  (CN) for Dalian Polytechnic University, Lin Han of Dalian  (CN) for Dalian Polytechnic University, Xiliang Yu of Dalian  (CN) for Dalian Polytechnic University, Xianda Du of Dalian  (CN) for Dalian Polytechnic University, Pengfei Jiang of Dalian  (CN) for Dalian Polytechnic University, Xuhui Huang of Dalian  (CN) for Dalian Polytechnic University, Beiwei Zhu of Dalian  (CN) for Dalian Polytechnic University

IPC Code(s): A23L13/60, A23L5/10, A23L13/40, A23L17/00, A23L33/125, A23L33/22, A23P20/15, A23P20/25

CPC Code(s): A23L13/67


[[Category:A23L13/60]][[Category:A23L5/10]][[Category:A23L13/40]][[Category:A23L17/00]][[Category:A23L33/125]][[Category:A23L33/22]][[Category:A23P20/15]][[Category:A23P20/25]][[Category:CPC_A23P20/25]][[Category:Dalian Polytechnic University]]



[[JX NIPPON MINING & METALS CORPORATION (20240335874). PURE COPPER OR COPPER ALLOY POWDER FOR ADDITIVE MANUFACTURING simplified abstract]]

Organization: JX NIPPON MINING & METALS CORPORATION

Inventor(s): Hirofumi WATANABE of Ibaraki  (JP) for JX NIPPON MINING & METALS CORPORATION, Yoshitaka SHIBUYA of Ibaraki  (JP) for JX NIPPON MINING & METALS CORPORATION, Masashi KUMAGAI of Tokyo  (JP) for JX NIPPON MINING & METALS CORPORATION

IPC Code(s): B22F1/16, B22F1/05, B33Y70/00

CPC Code(s): B22F1/16


[[Category:B22F1/16]][[Category:B22F1/05]][[Category:B33Y70/00]][[Category:CPC_B33Y70/00]][[Category:JX NIPPON MINING & METALS CORPORATION]]



[[JTEKT CORPORATION (20240335877). COMPOSITE PROCESSING MACHINE simplified abstract]]

Organization: JTEKT CORPORATION

Inventor(s): Makoto TANO of Obu-shi  (JP) for JTEKT CORPORATION, Takaya NAGAHAMA of Obu-shi  (JP) for JTEKT CORPORATION, Keisuke USUDA of Nagoya-shi  (JP) for JTEKT CORPORATION, Koichi SHIIBA of Nisshin-shi  (JP) for JTEKT CORPORATION, Kohei KATO of Nagoya-shi  (JP) for JTEKT CORPORATION, Masato ITO of Kariya-shi  (JP) for JTEKT CORPORATION

IPC Code(s): B22F10/28, B22F10/364, B22F10/368, B22F10/66, B33Y30/00, B33Y40/20

CPC Code(s): B22F10/28


[[Category:B22F10/28]][[Category:B22F10/364]][[Category:B22F10/368]][[Category:B22F10/66]][[Category:B33Y30/00]][[Category:B33Y40/20]][[Category:CPC_B33Y40/20]][[Category:JTEKT CORPORATION]]



[[PROTERIAL, LTD. (20240335879). METHOD FOR MEASURING DEFORMATION AMOUNT OF DEFORMATION PART OF ADDITIVELY MANUFACTURED TEST OBJECT AND METHOD FOR DETERMINING OPTIMUM CONDITION FOR ADDITIVE MANUFACTURING simplified abstract]]

Organization: PROTERIAL, LTD.

Inventor(s): Steven James OSMA of Tokyo  (JP) for PROTERIAL, LTD., Hirotsugu KAWANAKA of Tokyo  (JP) for PROTERIAL, LTD., Shinji MATSUSHITA of Tokyo  (JP) for PROTERIAL, LTD., Minseok PARK of Tokyo  (JP) for PROTERIAL, LTD., Yusuke YASUDA of Tokyo  (JP) for PROTERIAL, LTD.

IPC Code(s): B22F10/31, B22F10/85, B33Y50/02, B33Y80/00, G06T7/00

CPC Code(s): B22F10/31


[[Category:B22F10/31]][[Category:B22F10/85]][[Category:B33Y50/02]][[Category:B33Y80/00]][[Category:G06T7/00]][[Category:CPC_G06T7/00]][[Category:PROTERIAL, LTD.]]



[[Unknown Organization (20240335880). METHODS OF ULTRASOUND ASSISTED 3D PRINTING OF METALLIC ALLOYS simplified abstract]]

Organization: Unknown Organization

Inventor(s): Qingyou Han of Stow OH (US) for Unknown Organization

IPC Code(s): B22F10/50, B22F12/41, B22F12/63, B33Y10/00, B33Y40/00

CPC Code(s): B22F10/50


[[Category:B22F10/50]][[Category:B22F12/41]][[Category:B22F12/63]][[Category:B33Y10/00]][[Category:B33Y40/00]][[Category:CPC_B33Y40/00]][[Category:Unknown Organization]]



[[CASTHEON INC (20240335881). METHODS FOR 3D PRINTING AND ADDITIVE MANUFACTURING OF REFRACTORY ALLOYS simplified abstract]]

Organization: CASTHEON INC

Inventor(s): Youping Gao of Thousand Oaks CA (US) for CASTHEON INC

IPC Code(s): B22F10/60, B33Y10/00, B33Y40/20, B33Y70/00, C22C1/04, C23C24/08, C23C28/02

CPC Code(s): B22F10/60


[[Category:B22F10/60]][[Category:B33Y10/00]][[Category:B33Y40/20]][[Category:B33Y70/00]][[Category:C22C1/04]][[Category:C23C24/08]][[Category:C23C28/02]][[Category:CPC_C23C28/02]][[Category:CASTHEON INC]]



[[General Electric Company (20240335882). METHODS OF SEALING ADDITIVELY PRINTED CHANNELS AND PORTS simplified abstract]]

Organization: General Electric Company

Inventor(s): Richard M. DiCintio of Simpsonville SC (US) for General Electric Company, Srikanth C. Kottilingam of Greenville SC (US) for General Electric Company, Brad VanTassel of Greer SC (US) for General Electric Company

IPC Code(s): B22F10/68, B22F10/14

CPC Code(s): B22F10/68


[[Category:B22F10/68]][[Category:B22F10/14]][[Category:CPC_B22F10/14]][[Category:General Electric Company]]



[[Freeform Future Corp. (20240335883). BUILD PLATE WITH INTEGRATED COOLING CHANNELS simplified abstract]]

Organization: Freeform Future Corp.

Inventor(s): Daniel Roszhart Zehr of Erie CO (US) for Freeform Future Corp., Tasso Lappas of Pasadena CA (US) for Freeform Future Corp.

IPC Code(s): B22F12/30, B22F10/30, B22F12/90, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s): B22F12/30


[[Category:B22F12/30]][[Category:B22F10/30]][[Category:B22F12/90]][[Category:B33Y10/00]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:CPC_B33Y50/02]][[Category:Freeform Future Corp.]]



[[VulcanForms Inc. (20240335884). PHOTONIC LANTERN ARRAY simplified abstract]]

Organization: VulcanForms Inc.

Inventor(s): Peter Colin Reeves-Hall of Whitinsville MA (US) for VulcanForms Inc., Manuel Joseph Leonardo of Bolton MA (US) for VulcanForms Inc.

IPC Code(s): B22F12/41, B22F10/36, B22F10/85, B22F12/45, B22F12/90, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s): B22F12/41


[[Category:B22F12/41]][[Category:B22F10/36]][[Category:B22F10/85]][[Category:B22F12/45]][[Category:B22F12/90]][[Category:B33Y10/00]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:CPC_B33Y50/02]][[Category:VulcanForms Inc.]]



[[Unknown Organization (20240335902). METHODS OF ULTRASOUND ASSISTED WELDING simplified abstract]]

Organization: Unknown Organization

Inventor(s): Qingyou Han of Stow OH (US) for Unknown Organization

IPC Code(s): B23K20/10, B23K31/02

CPC Code(s): B23K20/106


[[Category:B23K20/10]][[Category:B23K31/02]][[Category:CPC_B23K31/02]][[Category:Unknown Organization]]



[[The Regents of the University of California (20240336007). ADDITIVE MANUFACTURING OF TUNABLE POLYMERIC 3D ARCHITECTURES FOR MULTIFUNCTIONAL APPLICATIONS simplified abstract]]

Organization: The Regents of the University of California

Inventor(s): David Kisailus of Irvine CA (US) for The Regents of the University of California, Devis Montroni of Irvine CA (US) for The Regents of the University of California

IPC Code(s): B29C64/188, B29C64/106, B29C64/209, B29C64/255, B29C64/393, B29K105/00, B29K105/12, B33Y10/00, B33Y30/00, B33Y50/02, B33Y70/00

CPC Code(s): B29C64/188


[[Category:B29C64/188]][[Category:B29C64/106]][[Category:B29C64/209]][[Category:B29C64/255]][[Category:B29C64/393]][[Category:B29K105/00]][[Category:B29K105/12]][[Category:B33Y10/00]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:B33Y70/00]][[Category:CPC_B33Y70/00]][[Category:The Regents of the University of California]]



[[International Business Machines Corporation (20240336008). THREE-DIMENSIONAL PRINTER NOZZLE FOR PROGRAMMATIC NOZZLE OPENING CROSS-SECTIONAL PROFILE CONTROL simplified abstract]]

Organization: International Business Machines Corporation

Inventor(s): Randy A. Rendahl of Raleigh NC (US) for International Business Machines Corporation, Mauro Marzorati of Lutz FL (US) for International Business Machines Corporation, Jeremy R. Fox of Georgetown TX (US) for International Business Machines Corporation, Sarbajit K. Rakshit of Kolkata  (IN) for International Business Machines Corporation

IPC Code(s): B29C64/209, B29C64/118, B29C64/295, B29C64/321

CPC Code(s): B29C64/209


[[Category:B29C64/209]][[Category:B29C64/118]][[Category:B29C64/295]][[Category:B29C64/321]][[Category:CPC_B29C64/321]][[Category:International Business Machines Corporation]]



[[BIOMODEX, S.A.S. (20240336012). DEVICES, SYSTEMS, AND METHODS FOR 3D PRINTING OF VASCULATURE simplified abstract]]

Organization: BIOMODEX, S.A.S.

Inventor(s): Samuel ORRU of Paris  (FR) for BIOMODEX, S.A.S.

IPC Code(s): B29C64/393, B33Y10/00, B33Y50/02, G06F30/10, G06F113/10, G06F119/18

CPC Code(s): B29C64/393


[[Category:B29C64/393]][[Category:B33Y10/00]][[Category:B33Y50/02]][[Category:G06F30/10]][[Category:G06F113/10]][[Category:G06F119/18]][[Category:CPC_G06F119/18]][[Category:BIOMODEX, S.A.S.]]



[[Thermwood Corporation (20240336013). WARP COMPENSATION FOR ADDITIVE MANUFACTURING simplified abstract]]

Organization: Thermwood Corporation

Inventor(s): Kenneth J. SUSNJARA of Birdseye IN (US) for Thermwood Corporation

IPC Code(s): B29C64/393, B29C64/10, B29C64/118, B33Y10/00, B33Y30/00, B33Y50/02, G06F30/20, G06F111/10, G06F113/10

CPC Code(s): B29C64/393


[[Category:B29C64/393]][[Category:B29C64/10]][[Category:B29C64/118]][[Category:B33Y10/00]][[Category:B33Y30/00]][[Category:B33Y50/02]][[Category:G06F30/20]][[Category:G06F111/10]][[Category:G06F113/10]][[Category:CPC_G06F113/10]][[Category:Thermwood Corporation]]



[[EOS GMBH ELECTRO OPTICAL SYSTEMS (20240336753). CHEMICAL TREATMENT OF COMPONENTS simplified abstract]]

Organization: EOS GMBH ELECTRO OPTICAL SYSTEMS

Inventor(s): Verena GALITZ of Krailling  (DE) for EOS GMBH ELECTRO OPTICAL SYSTEMS, Karl FREIHART of Germering  (DE) for EOS GMBH ELECTRO OPTICAL SYSTEMS, Matthias FROSCH of Bergtheim  (DE) for EOS GMBH ELECTRO OPTICAL SYSTEMS

IPC Code(s): C08J7/02, B29C64/35, B29C71/00, B33Y40/20, C08J7/14

CPC Code(s): C08J7/02


[[Category:C08J7/02]][[Category:B29C64/35]][[Category:B29C71/00]][[Category:B33Y40/20]][[Category:C08J7/14]][[Category:CPC_C08J7/14]][[Category:EOS GMBH ELECTRO OPTICAL SYSTEMS]]



[[Purdue Research Foundation (20240337024). METHOD OF ADDITIVE MANUFACTURING OF REFRACTORY ALLOY COATINGS simplified abstract]]

Organization: Purdue Research Foundation

Inventor(s): Yung C. Shin of West Lafayette IN (US) for Purdue Research Foundation, Kyung-Min Hong of San Jose CA (US) for Purdue Research Foundation

IPC Code(s): C23C24/10, B22F10/28, B22F10/64, B33Y10/00, B33Y40/20, B33Y80/00, C22C19/05, C22C19/07

CPC Code(s): C23C24/106


[[Category:C23C24/10]][[Category:B22F10/28]][[Category:B22F10/64]][[Category:B33Y10/00]][[Category:B33Y40/20]][[Category:B33Y80/00]][[Category:C22C19/05]][[Category:C22C19/07]][[Category:CPC_C22C19/07]][[Category:Purdue Research Foundation]]



[[Applied Materials, Inc. (20240337040). PLATING SEAL WITH IMPROVED SURFACE simplified abstract]]

Organization: Applied Materials, Inc.

Inventor(s): Kyle M. Hanson of Kalispell MT (US) for Applied Materials, Inc.

IPC Code(s): C25D17/00, B29C64/124

CPC Code(s): C25D17/004


[[Category:C25D17/00]][[Category:B29C64/124]][[Category:CPC_B29C64/124]][[Category:Applied Materials, Inc.]]



[[Massachusetts Institute of Technology (20240337191). DISCRETE MACROSCOPIC METAMATERIAL SYSTEMS simplified abstract]]

Organization: Massachusetts Institute of Technology

Inventor(s): Benjamin Jenett of Cambridge MA (US) for Massachusetts Institute of Technology

IPC Code(s): F01D5/28, E04B1/19, E04B1/344, F01D5/14

CPC Code(s): F01D5/286


[[Category:F01D5/28]][[Category:E04B1/19]][[Category:E04B1/344]][[Category:F01D5/14]][[Category:CPC_F01D5/14]][[Category:Massachusetts Institute of Technology]]



[[Heraeus Amloy Technologies GmbH (20240337284). THREADED ELEMENT WHICH COMPRISES OR CONSISTS OF A METAL AND WHICH HAS AN INTERNAL THREAD simplified abstract]]

Organization: Heraeus Amloy Technologies GmbH

Inventor(s): Beytullah Yasin KILIC of Hanau  (DE) for Heraeus Amloy Technologies GmbH, Ronald Allan ROSENBERGER of Hanau  (DE) for Heraeus Amloy Technologies GmbH, Hans Jürgen WACHTER of Karlstein  (DE) for Heraeus Amloy Technologies GmbH, Elena BIEN of Karlstein  (DE) for Heraeus Amloy Technologies GmbH, Tim GLÄSER of Karlstein  (DE) for Heraeus Amloy Technologies GmbH

IPC Code(s): F16B37/08, B22F5/06, B22F10/28, B33Y10/00, B33Y80/00

CPC Code(s): F16B37/0828


[[Category:F16B37/08]][[Category:B22F5/06]][[Category:B22F10/28]][[Category:B33Y10/00]][[Category:B33Y80/00]][[Category:CPC_B33Y80/00]][[Category:Heraeus Amloy Technologies GmbH]]



[[Applied Materials, Inc. (20240339301). CCP GAS DELIVERY NOZZLE simplified abstract]]

Organization: Applied Materials, Inc.

Inventor(s): Yogananda Sarode Vishwanath of Bangalore  (IN) for Applied Materials, Inc., Andrew Nguyen of San Jose CA (US) for Applied Materials, Inc., Tom K. Cho of Los Altos Hills CA (US) for Applied Materials, Inc.

IPC Code(s): H01J37/32, B33Y10/00, B33Y80/00

CPC Code(s): H01J37/3244


[[Category:H01J37/32]][[Category:B33Y10/00]][[Category:B33Y80/00]][[Category:CPC_B33Y80/00]][[Category:Applied Materials, Inc.]]



[[Applied Materials, Inc. (20240339302). ELECTRICAL BREAK FOR SUBSTRATE PROCESSING SYSTEMS simplified abstract]]

Organization: Applied Materials, Inc.

Inventor(s): Yogananda Sarode Vishwanath of Bangalore  (IN) for Applied Materials, Inc., Andrew Nguyen of San Jose CA (US) for Applied Materials, Inc., Tom K. Cho of Los Altos Hills CA (US) for Applied Materials, Inc.

IPC Code(s): H01J37/32, B33Y80/00

CPC Code(s): H01J37/32449


[[Category:H01J37/32]][[Category:B33Y80/00]][[Category:CPC_B33Y80/00]][[Category:Applied Materials, Inc.]]



[[The Research Foundation for The State University of New York (20240341057). LIQUID COOLED MULTI-CHIP COLD PLATES simplified abstract]]

Organization: The Research Foundation for The State University of New York

Inventor(s): Bahgat G. Sammakia of Vestal NY (US) for The Research Foundation for The State University of New York, Yaser Hadad of Binghamton NY (US) for The Research Foundation for The State University of New York, Mahdi Farahikia of Binghamton NY (US) for The Research Foundation for The State University of New York, Paul Chiarot of Binghamton NY (US) for The Research Foundation for The State University of New York

IPC Code(s): H05K7/20

CPC Code(s): H05K7/20254


[[Category:H05K7/20]][[Category:CPC_H05K7/20]][[Category:The Research Foundation for The State University of New York]]


[[Category:3D Printing]][[Category:The Research Foundation for The State University of New York]]