View source for 20250206995. Release Composition (LG Chem, .)

= RELEASE COMPOSITION =

'''Abstract''':
the present application provides a release composition, a release layer, a release film, and a pressure-sensitive adhesive film. the release composition of the present application has excellent curability, and thus can be stably cured to form a release layer. when the release layer has been formed, the present application can provide a release composition allowing to exhibit a stable residual adhesion rate even if the release layer is repeatedly applied to a pressure-sensitive adhesive layer or the like. the release layer of the present application can maintain desired release characteristics even if it is maintained at room temperature and a high temperature for a long time. in addition, the release layer can stably maintain a balance of high-speed and low-speed peeling forces.

'''Inventor(s)''': [[:Category:Jun Hyoung PARK of Daejeon  KR|Jun Hyoung PARK]], [[:Category:Hyun Cheol KIM of Daejeon  KR|Hyun Cheol KIM]]

'''CPC Classification''': [[:Category:CPC_C09J7/401|C09J7/401]] (ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES  (preparation of glue or gelatine ))


[[Category:Patent Applications]]
[[Category:LG Chem, Ltd.]]
[[Category:CPC_C09J7/401]]
[[Category:Jun Hyoung PARK of Daejeon  KR]]
[[Category:Hyun Cheol KIM of Daejeon  KR]]

[https://wikipatents.org/index.php?search=20250206995+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250206995]


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