View source for 20250205934. Mould Assembl (Asphetek Solution (Chengdu) .)

= MOULD ASSEMBLY AND PROCESSING METHOD OF MOULD ASSEMBLY =

'''Abstract''':
a mould assembly is provided, comprising an upper mould and a lower mould, a release film is provided between the upper mould and the lower mould, the lower mould defines a cavity for processing a workpiece, the release film covers the cavity, a bottom surface of the cavity provides an exhaust area, the exhaust area defines a plurality of exhaust grooves, the lower mould defines one or more through-holes, the plurality of exhaust grooves is communicated with the one or more through-holes, a width of each of the plurality of exhaust grooves is less than a thickness of the release film, the one or more through-holes draw the air to make the release film attach on the bottom surface of the cavity.

'''Inventor(s)''': [[:Category:YUAN-TING LIANG of Hsinchu  TW|YUAN-TING LIANG]], [[:Category:Chung-Wu LIU of Hsinchu  TW|Chung-Wu LIU]]

'''CPC Classification''': [[:Category:CPC_B29C33/10|B29C33/10]] (SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING  (making preforms ; making laminated products by combining previously unconnected layers which become one product whose layers will remain together  - ))


[[Category:Patent Applications]]
[[Category:Asphetek Solution (Chengdu) Ltd.]]
[[Category:CPC_B29C33/10]]
[[Category:YUAN-TING LIANG of Hsinchu  TW]]
[[Category:Chung-Wu LIU of Hsinchu  TW]]

[https://wikipatents.org/index.php?search=20250205934+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250205934]


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