View source for 20240055310. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:Huawei Technologies Co., Ltd.|Huawei Technologies Co., Ltd.]]


[[Category:Huawei Technologies Co., Ltd.]]

==Inventor(s)==

[[:Category:Jürgen H�gerl of Munich (DE)|Jürgen H�gerl of Munich (DE)]][[Category:Jürgen H�gerl of Munich (DE)]]

==SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240055310 titled 'SEMICONDUCTOR PACKAGE

==Simplified Explanation==

The semiconductor package described in the patent application includes a first substrate, a semiconductor chip, a leadframe with at least one lead, and an encapsulant. The lower main face of the encapsulant has different portions extending in different planes and transition zones to maintain a minimum distance between the encapsulant and the lead.

* The semiconductor package includes a first substrate, semiconductor chip, leadframe, and encapsulant.
* The encapsulant has different portions in different planes and transition zones.
* The encapsulant and substrate form a lower heat dissipation surface.
* The dimensions of the encapsulant portions are designed to maintain a minimum distance from the lead.

### Potential Applications
* Semiconductor packaging for electronic devices
* Integrated circuits
* Microprocessors

### Problems Solved
* Ensures proper heat dissipation
* Prevents short circuits between encapsulant and lead
* Provides structural integrity to the semiconductor package

### Benefits
* Improved thermal management
* Enhanced reliability of electronic components
* Optimal performance of semiconductor devices


==Original Abstract Submitted==

a semiconductor package includes a first substrate, a semiconductor chip, a leadframe comprising at least one lead, and an encapsulant. a lower main face of the encapsulant includes a first portion extending in a first plane, a second portion extending in a second plane, a third portion extending in a first transition zone between the first plane and the second plane, and a fourth portion extending in a second transition zone between the second plane and the at least one lead. both the first portion of the encapsulant and a lower main face of the first substrate extend in the first plane forming a lower heat dissipation surface of the package. the second portion, the third portion and the fourth portion of the encapsulant are dimensioned so as to keep a first predefined minimum distance between the first portion of the encapsulant and the at least one lead.



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