View source for 20240047844. HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS simplified abstract (CommScope Technologies LLC)

=HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS=


==Organization Name==

[[:Category:CommScope Technologies LLC|CommScope Technologies LLC]]


[[Category:CommScope Technologies LLC]]

==Inventor(s)==

[[:Category:Kamalakar Yeddula of Nandyala (IN)|Kamalakar Yeddula of Nandyala (IN)]][[Category:Kamalakar Yeddula of Nandyala (IN)]]

[[:Category:NBVS Krishna of Pamarru (IN)|NBVS Krishna of Pamarru (IN)]][[Category:NBVS Krishna of Pamarru (IN)]]

[[:Category:Rakesh Kalwani of Margao (IN)|Rakesh Kalwani of Margao (IN)]][[Category:Rakesh Kalwani of Margao (IN)]]

[[:Category:Kumara Swamy Kasani of Godavarikhani (IN)|Kumara Swamy Kasani of Godavarikhani (IN)]][[Category:Kumara Swamy Kasani of Godavarikhani (IN)]]

==HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240047844 titled 'HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS

==Simplified Explanation==

The abstract describes a hybrid coupler that consists of a printed circuit board with two metallization layers. The first metallization layer has multiple input and output ports, while the second metallization layer is located below the first layer. The hybrid coupler also includes several couplers that are connected to each other on the first metallization layer. Each coupler has transmission traces that are electrically coupled with the transmission traces of adjacent couplers. The transmission traces of the couplers extend between the input and output ports of the first metallization layer. Additionally, the hybrid coupler features a defective ground structure with a predefined shape in the second metallization layer below each coupling junction formed between the transmission traces of the couplers.

* The hybrid coupler is composed of a printed circuit board with two metallization layers.
* The first metallization layer contains multiple input and output ports.
* The second metallization layer is positioned below the first layer.
* The hybrid coupler includes multiple couplers connected to each other on the first metallization layer.
* Each coupler has transmission traces that are electrically coupled with adjacent couplers.
* The transmission traces of the couplers extend between the input and output ports of the first metallization layer.
* The hybrid coupler incorporates a defective ground structure with a predefined shape in the second metallization layer below each coupling junction formed between the transmission traces of the couplers.

== Potential Applications ==
* Telecommunications systems
* Wireless communication devices
* Radar systems
* Antenna systems

== Problems Solved ==
* Efficient signal splitting and combining in communication systems
* Minimizing signal loss and interference
* Compact and integrated design for space-constrained applications

== Benefits ==
* Improved signal transmission and reception
* Enhanced system performance and reliability
* Compact and space-saving design
* Cost-effective manufacturing and assembly


==Original Abstract Submitted==

a hybrid coupler is disclosed. the hybrid coupler comprises a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer. the first metallization layer comprises at least two input ports and at least two output ports. the hybrid coupler further comprises a plurality of couplers coupled adjacent to each other on the first metallization layer. each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer. the hybrid coupler furthermore comprises a defective ground structure having a pre-defined shape defined in the second metallization layer below each coupling junction formed between the transmission traces of the plurality of couplers.



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