View source for 20240038805. METHOD FOR DEFINING A GAP HEIGHT WITHIN AN IMAGE SENSOR PACKAGE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)

=METHOD FOR DEFINING A GAP HEIGHT WITHIN AN IMAGE SENSOR PACKAGE=


==Organization Name==

[[:Category:SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC|SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC]]


[[Category:SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC]]

==Inventor(s)==

[[:Category:Yu-Te Hsieh of Taoyuan City (TW)|Yu-Te Hsieh of Taoyuan City (TW)]][[Category:Yu-Te Hsieh of Taoyuan City (TW)]]

==METHOD FOR DEFINING A GAP HEIGHT WITHIN AN IMAGE SENSOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240038805 titled 'METHOD FOR DEFINING A GAP HEIGHT WITHIN AN IMAGE SENSOR PACKAGE

==Simplified Explanation==

The abstract describes an image sensor package that includes a substrate, an image sensor die, a light transmitting member, and pillar members. The height of the pillar members determines the gap height between the image sensor die and the light transmitting member. The package also includes a bonding material that connects the light transmitting member to the image sensor, with the bonding material contacting a side of a pillar member.

* The image sensor package includes a substrate, image sensor die, light transmitting member, and pillar members.
* The height of the pillar members defines the gap height between the image sensor die and the light transmitting member.
* The package uses a bonding material to connect the light transmitting member to the image sensor die.
* The bonding material contacts a side of a pillar member that extends between the light transmitting member and the image sensor die.

Potential Applications:
* This image sensor package can be used in various electronic devices that require image sensing capabilities, such as smartphones, digital cameras, and surveillance systems.
* It can also be applied in medical imaging devices, automotive cameras, and industrial inspection systems.

Problems Solved:
* The image sensor package solves the problem of maintaining a precise gap height between the image sensor die and the light transmitting member, which is crucial for optimal image quality.
* The bonding material ensures a secure connection between the light transmitting member and the image sensor die, preventing any misalignment or detachment.

Benefits:
* The precise gap height provided by the pillar members ensures accurate focusing and image capture, resulting in high-quality images.
* The bonding material enhances the structural integrity of the image sensor package, reducing the risk of damage or malfunction.
* The package design allows for efficient light transmission, maximizing the sensor's sensitivity and improving overall performance.


==Original Abstract Submitted==

according to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. a height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. the image sensor package including a bonding material that couples the light transmitting member to the image sensor. the bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.



[[Category:H01L27/146]]