View source for 20240035911. SENSOR HEADER ASSEMBLY FOR INCREASED RELIABILITY IN HIGH-PRESSURE ENVIRONMENTS simplified abstract (KULITE SEMICONDUCTOR PRODUCTS, INC.)

=SENSOR HEADER ASSEMBLY FOR INCREASED RELIABILITY IN HIGH-PRESSURE ENVIRONMENTS=


==Organization Name==

[[:Category:KULITE SEMICONDUCTOR PRODUCTS, INC.|KULITE SEMICONDUCTOR PRODUCTS, INC.]]


[[Category:KULITE SEMICONDUCTOR PRODUCTS, INC.]]

==Inventor(s)==

[[:Category:Alexander A. Ned of Kinnelon NJ (US)|Alexander A. Ned of Kinnelon NJ (US)]][[Category:Alexander A. Ned of Kinnelon NJ (US)]]

[[:Category:Scott Goodman of Wayne NJ (US)|Scott Goodman of Wayne NJ (US)]][[Category:Scott Goodman of Wayne NJ (US)]]

==SENSOR HEADER ASSEMBLY FOR INCREASED RELIABILITY IN HIGH-PRESSURE ENVIRONMENTS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240035911 titled 'SENSOR HEADER ASSEMBLY FOR INCREASED RELIABILITY IN HIGH-PRESSURE ENVIRONMENTS

==Simplified Explanation==

The abstract of the patent application describes a construction and technique for sensor header assembly that utilizes header layers to support electrical interconnections. The assembly includes an upper header layer with through holes arranged in a specific configuration, a lower header layer with through holes arranged in a different configuration, and depressions on the lower header layer that correspond to the configuration of the upper through holes. Upper header pins extend through the upper through holes and partially into the depressions, while lower header pins extend through the lower through holes and are in electrical communication with the upper header pins. The depressions provide support surfaces for the upper header pins during high-pressure operation.

* The patent application describes a sensor header assembly that utilizes upper and lower header layers to support electrical interconnections.
* The upper and lower header layers have through holes arranged in different configurations.
* Depressions on the lower header layer correspond to the configuration of the upper through holes.
* Upper header pins extend through the upper through holes and partially into the depressions.
* Lower header pins extend through the lower through holes and are in electrical communication with the upper header pins.
* The depressions on the lower header layer provide support surfaces for the upper header pins during high-pressure operation.

Potential Applications:
* This technology can be applied in various sensor systems that require electrical interconnections.
* It can be used in automotive sensors, industrial sensors, and medical sensors.
* The sensor header assembly can be utilized in high-pressure environments where support for electrical interconnections is crucial.

Problems Solved:
* The construction and technique described in the patent application solve the problem of providing support for electrical interconnections in sensor header assemblies.
* It addresses the issue of maintaining stable electrical connections during high-pressure operation.

Benefits:
* The use of header layers and depressions provides support for electrical interconnections, ensuring stable and reliable operation.
* The construction allows for flexibility in arranging the through holes, accommodating different configurations and requirements.
* The sensor header assembly can withstand high-pressure environments, making it suitable for various applications.


==Original Abstract Submitted==

header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. a sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. the depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.



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