View source for 20240019331. THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY simplified abstract (Edwards Limited)

=THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY=


==Organization Name==

[[:Category:Edwards Limited|Edwards Limited]]


[[Category:Edwards Limited]]

==Inventor(s)==

[[:Category:Glen Croft of Burgess Hill, Sussex (GB)|Glen Croft of Burgess Hill, Sussex (GB)]][[Category:Glen Croft of Burgess Hill, Sussex (GB)]]

[[:Category:Nicholas Daniel Hutton of Burgess Hill, Sussex (GB)|Nicholas Daniel Hutton of Burgess Hill, Sussex (GB)]][[Category:Nicholas Daniel Hutton of Burgess Hill, Sussex (GB)]]

[[:Category:Gary Michael George Lord of Burgess Hill, Sussex (GB)|Gary Michael George Lord of Burgess Hill, Sussex (GB)]][[Category:Gary Michael George Lord of Burgess Hill, Sussex (GB)]]

[[:Category:Matthew Gareth Key of Burgess Hill, Sussex (GB)|Matthew Gareth Key of Burgess Hill, Sussex (GB)]][[Category:Matthew Gareth Key of Burgess Hill, Sussex (GB)]]

==THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240019331 titled 'THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY

==Simplified Explanation==

The present disclosure is about a thermal conductivity vacuum gauge assembly. It consists of a body with an internal chamber for holding working gas and a heater element inside the chamber. The body has an outer facing wall surface and an opposing inner facing wall surface. The assembly also includes a thermal compensation element and a thermal equalization element that are in thermal communication with the body. The body is made of a material with a lower thermal conductivity, while the thermal equalization element is made of a material with a higher thermal conductivity.

* The assembly is designed to measure thermal conductivity in a vacuum.
* The body of the assembly contains a chamber for holding working gas.
* A heater element is placed inside the chamber to generate heat.
* The body has an outer facing wall surface and an inner facing wall surface.
* A thermal compensation element and a thermal equalization element are in thermal communication with the body.
* The body is made of a material with lower thermal conductivity.
* The thermal equalization element is made of a material with higher thermal conductivity.

Potential applications of this technology:

* Vacuum systems and processes that require accurate measurement of thermal conductivity.
* Industrial applications where vacuum conditions need to be monitored and controlled.
* Research and development in fields such as materials science, semiconductor manufacturing, and aerospace.

Problems solved by this technology:

* Provides a reliable and accurate method for measuring thermal conductivity in a vacuum.
* Allows for better control and optimization of vacuum processes.
* Helps identify and troubleshoot issues related to thermal conductivity in vacuum systems.

Benefits of this technology:

* Improved efficiency and performance of vacuum systems.
* Enhanced process control and optimization.
* Cost savings through better monitoring and maintenance of vacuum processes.
* Facilitates research and development in various industries.


==Original Abstract Submitted==

the present disclosure relates to a thermal conductivity vacuum gauge assembly. the assembly comprises a body defining an internal chamber for receiving working gas and a heater element disposed within the chamber. the body is defined by a wall having an outer facing wall surface and an opposing inner facing wall surface. a thermal compensation element and a thermal equalisation element are in thermal communication with the body. the body is made of a material with a first thermal conductivity, and the thermal equalisation element is made of a material with a second thermal conductivity that is higher than the first thermal conductivity. the present disclosure also relates to a thermal conductivity vacuum gauge including the assembly.



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