View source for 20240011156. DEPOSITION APPARATUS simplified abstract (Samsung Display Co., Ltd.)

=DEPOSITION APPARATUS=


==Organization Name==

[[:Category:Samsung Display Co., Ltd.|Samsung Display Co., Ltd.]]


[[Category:Samsung Display Co., Ltd.]]

==Inventor(s)==

[[:Category:CHOELMIN Jang of Seoul (KR)|CHOELMIN Jang of Seoul (KR)]][[Category:CHOELMIN Jang of Seoul (KR)]]

[[:Category:JUNGGON Kim of Hwaseong-si (KR)|JUNGGON Kim of Hwaseong-si (KR)]][[Category:JUNGGON Kim of Hwaseong-si (KR)]]

[[:Category:MYUNGSOO Huh of Suwon-si (KR)|MYUNGSOO Huh of Suwon-si (KR)]][[Category:MYUNGSOO Huh of Suwon-si (KR)]]

==DEPOSITION APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240011156 titled 'DEPOSITION APPARATUS

==Simplified Explanation==

The deposition apparatus described in the patent application includes a gas supply with multiple gas injection ports. There is a plate that faces the gas supply and can move up and down towards it, with a target substrate seated on the plate. The apparatus also has a body part with a first portion that creates a reaction space between the plate and the gas supply, and a second portion below it that defines a lower space. An inner wall is spaced apart from the plate, and there are multiple first exhaust parts provided on the outer wall of the first portion.

* The apparatus is designed for deposition processes, where gas is injected into a reaction space to interact with a target substrate.
* The plate's ability to move up and down allows for precise control of the distance between the gas supply and the substrate.
* The body part's design creates separate spaces for the reaction and exhaust, preventing interference between the two.
* The presence of multiple gas injection ports and exhaust parts allows for uniform and efficient distribution of gas and exhaust.
* The inner wall helps to maintain a stable environment within the reaction space and prevents unwanted interactions with the outer wall.
* The apparatus can be used in various deposition techniques, such as chemical vapor deposition or physical vapor deposition.

Potential applications of this technology:

* Thin film deposition: The apparatus can be used to deposit thin films of various materials onto substrates, which is essential in industries like electronics, optics, and coatings.
* Semiconductor manufacturing: Deposition processes are crucial in the fabrication of semiconductor devices, and this apparatus can contribute to improved quality and efficiency.
* Solar cell production: The precise control and uniform distribution of gas in the reaction space can enhance the deposition of materials used in solar cell manufacturing.
* Surface modification: The apparatus can be utilized for surface treatments, such as creating protective coatings or functionalizing surfaces for specific applications.

Problems solved by this technology:

* Precise control: The ability to adjust the distance between the gas supply and substrate ensures accurate deposition and avoids issues like uneven film thickness.
* Uniformity: The multiple gas injection ports and exhaust parts help achieve uniform distribution of gas and exhaust, leading to consistent deposition results.
* Interference prevention: The separate spaces for reaction and exhaust prevent unwanted interactions and contamination, improving the quality of the deposited films.
* Stability: The presence of an inner wall helps maintain a stable environment within the reaction space, reducing the impact of external factors.

Benefits of this technology:

* Enhanced deposition quality: The apparatus allows for precise control and uniform distribution, resulting in high-quality deposited films with improved properties.
* Increased efficiency: The design of the apparatus optimizes gas flow and exhaust, maximizing the utilization of resources and reducing process time.
* Versatility: The apparatus can be adapted for various deposition techniques and can accommodate different types of substrates and materials.
* Improved reliability: The prevention of interference and stable environment maintenance contribute to reliable and repeatable deposition processes.


==Original Abstract Submitted==

a deposition apparatus includes a gas supply including a plurality of gas injection ports, a plate disposed to face the gas supply and to move up and down toward the gas supply, wherein a target substrate is seated on the plate, a body part includes a first portion defining a reaction space between the plate and the gas supply, a second portion disposed below the first portion and defining a lower space, an inner wall spaced apart from the plate, and a plurality of first exhaust parts provided on an outer wall of the first portion.



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