View source for 19001626. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)

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=ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS=


==Organization Name==

[[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]


[[Category:Tokyo Electron Limited]]

==Inventor(s)==

[[:Category:Naoki Matsumoto of Miyagi JP|Naoki Matsumoto of Miyagi JP]][[Category:Naoki Matsumoto of Miyagi JP]]

[[:Category:Toshihisa Ozu of Miyagi JP|Toshihisa Ozu of Miyagi JP]][[Category:Toshihisa Ozu of Miyagi JP]]

[[:Category:Satoru Nakamura of Miyagi JP|Satoru Nakamura of Miyagi JP]][[Category:Satoru Nakamura of Miyagi JP]]

[[:Category:Yusuke Shimizu of Gyeonggi-do KR|Yusuke Shimizu of Gyeonggi-do KR]][[Category:Yusuke Shimizu of Gyeonggi-do KR]]

==ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS==


This abstract first appeared for US patent application 19001626 titled 'ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS

==Original Abstract Submitted==

An adjustment method includes: acquiring reference distribution data that is data on a distribution of an ion flux that occurs between plasma generated in a first chamber and a substrate placed at a first substrate support disposed in the first chamber in a first plasma processing apparatus including the first chamber and the first substrate support; acquiring distribution data that is data on a distribution of an ion flux that occurs between plasma generated in a second chamber and a substrate placed at a second substrate support disposed in the second chamber in a second plasma processing apparatus including the second chamber and the second substrate support; and adjusting an element capable of adjusting the ion flux in the second plasma processing apparatus based on the distribution data acquired in the second plasma processing apparatus and the reference distribution data acquired in the first plasma processing apparatus.



[[Category:H01J37/32]]
[[Category:CPC_H01J37/32926]]