View source for 18976946. REPAIR OF A SILICON-BASED BONDCOAT (GENERAL ELECTRIC COMPANY)

=REPAIR OF A SILICON-BASED BONDCOAT=


==Organization Name==

[[:Category:GENERAL ELECTRIC COMPANY|GENERAL ELECTRIC COMPANY]]


[[Category:GENERAL ELECTRIC COMPANY]]

==Inventor(s)==

[[:Category:Julin Wan of Rexford NY US|Julin Wan of Rexford NY US]][[Category:Julin Wan of Rexford NY US]]

==REPAIR OF A SILICON-BASED BONDCOAT==


This abstract first appeared for US patent application 18976946 titled 'REPAIR OF A SILICON-BASED BONDCOAT

==Original Abstract Submitted==

Methods are provided for repairing a defect on a silicon-containing substrate. The method may include applying a powder mixture into the defect of an existing coating on a surface of the silicon-containing substrate, wherein the powder mixture comprises silicon and germanium at a Ge mole fraction of 0.01 to 0.3; and heat treating the powder mixture within the defect at a sintering temperature that is 1150° C. to 1400° C. to form a repaired bondcoat within the defect. Repaired components are also provided that include a repaired bondcoat formed within the defect on the silicon-containing substrate, wherein the repaired bondcoat comprises a silicon-germanium phase comprising a Ge mole fraction of germanium of 0.01 to 0.3 and a Si mole fraction of silicon of 0.7 to 0.99.



[[Category:C04B41/50]]
[[Category:C04B41/00]]
[[Category:C04B41/45]]
[[Category:C04B41/52]]
[[Category:C04B41/87]]
[[Category:C04B41/89]]
[[Category:CPC_C04B41/5096]]