View source for 18967855. CIRCUIT BOARD (LG INNOTEK CO., LTD.)

=CIRCUIT BOARD=


==Organization Name==

[[:Category:LG INNOTEK CO., LTD.|LG INNOTEK CO., LTD.]]


[[Category:LG INNOTEK CO., LTD.]]

==Inventor(s)==

[[:Category:Dong Keon Lee of Seoul KR|Dong Keon Lee of Seoul KR]][[Category:Dong Keon Lee of Seoul KR]]

[[:Category:Jung Hoon Park of Seoul KR|Jung Hoon Park of Seoul KR]][[Category:Jung Hoon Park of Seoul KR]]

[[:Category:Seok Jong Youh of Seoul KR|Seok Jong Youh of Seoul KR]][[Category:Seok Jong Youh of Seoul KR]]

==CIRCUIT BOARD==


This abstract first appeared for US patent application 18967855 titled 'CIRCUIT BOARD

==Original Abstract Submitted==

A circuit board according to an embodiment includes an insulating layer; a first circuit pattern disposed on a first surface of the insulating layer; a first solder resist disposed on the first surface of the insulating layer; and a first barrier layer including a first-first portion disposed between the first solder resist and the first circuit pattern, and a first-second portion disposed between the insulating layer and the first circuit pattern; wherein the firs-first portion of the first barrier layer includes: a first-first gold (Au) layer disposed under a lower surface of the first circuit pattern; and a first-first palladium (Pd) layer disposed under a lower surface of the first-first gold (Au) layer; wherein the first-second portion of the first barrier layer includes: a first-second gold (Au) layer disposed to surround a side surface and an upper surface of the first circuit pattern; and a first-second palladium (Pd) layer disposed to surround the first-second gold (Au) layer; and wherein the first circuit pattern is not in contact with the first solder resist and the insulating layer by the first-first portion and the first-second portion of the first barrier layer.



[[Category:H05K1/02]]
[[Category:H05K1/09]]
[[Category:CPC_H05K1/0256]]