View source for 18820361. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE (ROHM CO., LTD.)

=SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE=


==Organization Name==

[[:Category:ROHM CO., LTD.|ROHM CO., LTD.]]


[[Category:ROHM CO., LTD.]]

==Inventor(s)==

[[:Category:Takeshi Okamoto of Kyoto-shi (JP)|Takeshi Okamoto of Kyoto-shi (JP)]][[Category:Takeshi Okamoto of Kyoto-shi (JP)]]

==SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE==


This abstract first appeared for US patent application 18820361 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE




==Original Abstract Submitted==

The semiconductor device includes a semiconductor chip that has a first principal surface, a withstand-voltage holding structure in a peripheral region in the first principal surface, a plurality of first conductive layers that are formed in the first principal surface, a second conductive layer overlaps with a space between the plurality of mutually adjacent first conductive layers in a plan view, and a protective layer that covers the plurality of first conductive layers and the second conductive layer.



[[Category:H01L23/495]]
[[Category:H01L23/00]]
[[Category:H01L29/40]]
[[Category:H01L29/739]]
[[Category:CPC_H01L23/49562]]