View source for 18781453. DAMPING STRUCTURE (Apple Inc.)

=DAMPING STRUCTURE=


==Organization Name==

[[:Category:Apple Inc.|Apple Inc.]]


[[Category:Apple Inc.]]

==Inventor(s)==

[[:Category:Shawn X. Arnold of Cupertion CA (US)|Shawn X. Arnold of Cupertion CA (US)]][[Category:Shawn X. Arnold of Cupertion CA (US)]]

[[:Category:Zhongqing Gong of Fremont CA (US)|Zhongqing Gong of Fremont CA (US)]][[Category:Zhongqing Gong of Fremont CA (US)]]

[[:Category:Anping Guo of San Jose CA (US)|Anping Guo of San Jose CA (US)]][[Category:Anping Guo of San Jose CA (US)]]

==DAMPING STRUCTURE==


This abstract first appeared for US patent application 18781453 titled 'DAMPING STRUCTURE

==Original Abstract Submitted==

The present disclosure describes a structure with a substrate, a damping structure, and a capacitor structure. The damping structure is disposed over the substrate and includes a rigid material layer and a damping material layer disposed on the rigid material layer. The damping material layer includes a damping material with a tensile strength of about 20 MPa, a Young's modulus of about 0.5 GPa, and an elongation of about 10%. The capacitor structure is disposed over the damping structure, in which the damping structure mitigates (or eliminates) a transfer of piezoelectric and electrostrictive vibrations generated by the capacitor structure to the substrate.



[[Category:H05K1/02]]
[[Category:H05K1/11]]
[[Category:CPC_H05K1/0271]]