View source for 18774455. Wideband Millimeter Wave Via Transition (Apple Inc.)

=Wideband Millimeter Wave Via Transition=


==Organization Name==

[[:Category:Apple Inc.|Apple Inc.]]


[[Category:Apple Inc.]]

==Inventor(s)==

[[:Category:Chi V. Pham of San Jose CA (US)|Chi V. Pham of San Jose CA (US)]][[Category:Chi V. Pham of San Jose CA (US)]]

[[:Category:Xiaofang Mu of Cupertino CA (US)|Xiaofang Mu of Cupertino CA (US)]][[Category:Xiaofang Mu of Cupertino CA (US)]]

==Wideband Millimeter Wave Via Transition==


This abstract first appeared for US patent application 18774455 titled 'Wideband Millimeter Wave Via Transition




==Original Abstract Submitted==

Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.



[[Category:H05K1/11]]
[[Category:H01P3/08]]
[[Category:H05K1/02]]
[[Category:CPC_H05K1/116]]