View source for 18756034. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)

=SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:Murata Manufacturing Co., Ltd.|Murata Manufacturing Co., Ltd.]]


[[Category:Murata Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Mari Saji of Nagaokakyo-shi (JP)|Mari Saji of Nagaokakyo-shi (JP)]][[Category:Mari Saji of Nagaokakyo-shi (JP)]]

[[:Category:Atsushi Kurokawa of Nagaokakyo-shi (JP)|Atsushi Kurokawa of Nagaokakyo-shi (JP)]][[Category:Atsushi Kurokawa of Nagaokakyo-shi (JP)]]

[[:Category:Masahiro Shibata of Nagaokakyo-shi (JP)|Masahiro Shibata of Nagaokakyo-shi (JP)]][[Category:Masahiro Shibata of Nagaokakyo-shi (JP)]]

==SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18756034 titled 'SEMICONDUCTOR DEVICE

'''Simplified Explanation:'''
The semiconductor device described in the patent application includes a semiconductor substrate, a transistor with multiple semiconductor layers, an electrode for the transistor, an organic insulating film with an opening over the transistor and electrode, and a bump connected to the electrode through the opening.

* The semiconductor device has a unique structure with specific features to improve its functionality and performance.
* The bump is strategically placed and sized to ensure proper electrical connection while maintaining the integrity of the organic insulating film.
* The innovation aims to enhance the overall efficiency and reliability of the semiconductor device.
* By optimizing the design and layout of the components, the device can operate more effectively in various applications.
* The technology offers a practical solution to challenges commonly faced in semiconductor device manufacturing.

'''Potential Applications:'''
The semiconductor device can be utilized in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
It can also find applications in industrial equipment, automotive systems, and communication devices.
The technology can be integrated into sensors, actuators, and other electronic components for improved performance.

'''Problems Solved:'''
The technology addresses issues related to electrical connections in semiconductor devices.
It solves challenges associated with maintaining insulation integrity while ensuring proper functionality.
The design helps overcome limitations in traditional semiconductor device structures.

'''Benefits:'''
Enhanced electrical connectivity and reliability.
Improved performance and efficiency of semiconductor devices.
Optimized design for better integration into electronic systems.
Potential cost savings in manufacturing processes.

'''Commercial Applications:'''
Title: Advanced Semiconductor Device for Enhanced Electronic Systems
The technology can be commercialized by semiconductor manufacturers for producing high-performance electronic components.
It can be marketed to companies in the consumer electronics, automotive, and industrial sectors.
The innovation offers a competitive edge in the semiconductor industry by providing more reliable and efficient devices.

'''Questions about the Technology:'''
1. What are the specific advantages of using organic insulating film in semiconductor devices?
   - Organic insulating film offers improved insulation properties and can be more environmentally friendly compared to traditional materials.
2. How does the size and placement of the bump impact the overall performance of the semiconductor device?
   - The size and placement of the bump are crucial in ensuring proper electrical connection and preventing interference with other components.


==Original Abstract Submitted==

A semiconductor device includes a semiconductor substrate; at least one transistor located on the semiconductor substrate and including a plurality of semiconductor layers; an electrode provided for the transistor; an organic insulating film having an opening in a region overlapping the transistor and the electrode in plan view in a first direction perpendicular to the semiconductor substrate; and a bump located over the at least one transistor in plan view in the first direction and electrically connected to the electrode through the opening of the organic insulating film. The width of the bump in a second direction parallel to the semiconductor substrate is smaller than the width of the opening of the organic insulating film in the second direction.



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