View source for 18752680. RESONATING STRUCTURE FOR A DIELECTRIC FILTER COMPRISING A DIELECTRIC BODY INCLUDING OFFSET FIRST AND SECOND BLIND COUPLING HOLES WITH RESPECTIVE DEFECTED PORTIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))

=RESONATING STRUCTURE FOR A DIELECTRIC FILTER COMPRISING A DIELECTRIC BODY INCLUDING OFFSET FIRST AND SECOND BLIND COUPLING HOLES WITH RESPECTIVE DEFECTED PORTIONS=


==Organization Name==

[[:Category:Telefonaktiebolaget LM Ericsson (publ)|Telefonaktiebolaget LM Ericsson (publ)]]


[[Category:Telefonaktiebolaget LM Ericsson (publ)]]

==Inventor(s)==

[[:Category:Peiguang Lu of Beijing (CN)|Peiguang Lu of Beijing (CN)]][[Category:Peiguang Lu of Beijing (CN)]]

[[:Category:Haitao Liu of Beijing (CN)|Haitao Liu of Beijing (CN)]][[Category:Haitao Liu of Beijing (CN)]]

[[:Category:Weidong Wang of Beijing (CN)|Weidong Wang of Beijing (CN)]][[Category:Weidong Wang of Beijing (CN)]]

==RESONATING STRUCTURE FOR A DIELECTRIC FILTER COMPRISING A DIELECTRIC BODY INCLUDING OFFSET FIRST AND SECOND BLIND COUPLING HOLES WITH RESPECTIVE DEFECTED PORTIONS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18752680 titled 'RESONATING STRUCTURE FOR A DIELECTRIC FILTER COMPRISING A DIELECTRIC BODY INCLUDING OFFSET FIRST AND SECOND BLIND COUPLING HOLES WITH RESPECTIVE DEFECTED PORTIONS

'''Simplified Explanation''': 

The patent application describes a resonating structure and a dielectric filter. The resonating structure is made of a solid dielectric material and includes negative coupling holes and a conductive material layer. 

* The resonating structure is made of a solid dielectric material.
* It includes at least two resonators.
* Negative coupling holes are formed at the connection between two adjacent resonators.
* Each set of negative coupling holes consists of a first blind hole and a second blind hole on opposite surfaces of the body.
* The conductive material layer covers the surfaces of the body, first blind hole, and second blind hole.

'''Key Features and Innovation''':

* Resonating structure made of solid dielectric material.
* Negative coupling holes for improved performance.
* Conductive material layer for enhanced functionality.

'''Potential Applications''':

The technology can be used in telecommunications, radar systems, and wireless communication devices.

'''Problems Solved''':

The technology addresses the need for efficient resonating structures with improved performance.

'''Benefits''':

* Enhanced resonance and filtering capabilities.
* Improved signal processing in communication systems.

'''Commercial Applications''':

Potential commercial uses include telecommunications equipment, radar systems, and wireless communication devices.

'''Prior Art''''':

Readers can explore prior patents related to resonating structures and dielectric filters to understand the evolution of this technology.

'''Frequently Updated Research''':

Stay updated on the latest advancements in resonating structures and dielectric filters to leverage cutting-edge technology in your applications.

'''Questions about Resonating Structures and Dielectric Filters''':

1. What are the key advantages of using a solid dielectric material in resonating structures?
2. How do negative coupling holes improve the performance of resonating structures?


==Original Abstract Submitted==

A resonating structure and a dielectric filter having the same are disclosed. The resonating structure comprises a body, at least one set of negative coupling holes, and a conductive material layer. The body is made of a solid dielectric material and comprises at least two resonators. The negative coupling holes are formed at a connection between two adjacent resonators. Each set of negative coupling holes comprises a first blind hole and a second blind hole disposed on two opposite surfaces of the body respectively. The first blind hole and the second blind hole are offset from each other in a plane perpendicular to a direction along which the first or second blind hole is dug. The conductive material layer covers surfaces of the body and surfaces of the first blind hole and the second blind hole.



[[Category:H01P1/20]]
[[Category:H01P1/205]]
[[Category:H01P1/208]]
[[Category:H01P7/06]]
[[Category:H01P7/10]]
[[Category:CPC_H01P1/2002]]