View source for 18745638. SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)

=SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Hyunsuk Chun of Boise ID (US)|Hyunsuk Chun of Boise ID (US)]][[Category:Hyunsuk Chun of Boise ID (US)]]

[[:Category:Xiaopeng Qu of Boise ID (US)|Xiaopeng Qu of Boise ID (US)]][[Category:Xiaopeng Qu of Boise ID (US)]]

==SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18745638 titled 'SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME

The abstract describes a patent application for semiconductor device assemblies with layers of thermally conductive material between adjacent semiconductor dies in a vertical stack. The material conducts heat laterally outward towards the edge of the assembly and can include carbon allotropes like diamond, graphene, graphite, carbon nanotubes, or a combination. The material can be applied through deposition or by adhering a film containing the thermally conductive layer to the semiconductor dies.

* The patent application focuses on improving thermal management in semiconductor device assemblies.
* The use of thermally conductive material between semiconductor dies helps dissipate heat efficiently.
* Various carbon allotropes are utilized for their excellent thermal conductivity properties.
* The application methods include deposition techniques like sputtering, PVD, CVD, or ALD, as well as film adhesion.
* The innovation aims to enhance the overall performance and reliability of semiconductor devices.

Potential Applications:
- High-performance computing systems
- Data centers
- Automotive electronics
- Aerospace technology
- Medical devices

Problems Solved:
- Overheating issues in semiconductor devices
- Thermal management challenges in stacked assemblies
- Improving overall device reliability and longevity

Benefits:
- Enhanced heat dissipation capabilities
- Improved performance under high thermal loads
- Increased device lifespan and reliability
- Potential for smaller form factors in electronic devices
- Energy efficiency gains in various applications

Commercial Applications:
Title: "Thermally Conductive Semiconductor Device Assemblies: Commercial Applications and Market Implications"
This technology could be utilized in various industries such as consumer electronics, telecommunications, industrial automation, and renewable energy sectors. The market implications include improved product performance, reliability, and potentially reduced maintenance costs for companies integrating these semiconductor device assemblies.

Questions about Semiconductor Device Assemblies:
1. How does the use of thermally conductive material improve the performance of semiconductor devices?
- The use of thermally conductive material helps dissipate heat efficiently, preventing overheating and improving overall device reliability.
2. What are the potential applications of semiconductor device assemblies with thermally conductive layers?
- Potential applications include high-performance computing systems, data centers, automotive electronics, aerospace technology, and medical devices.


==Original Abstract Submitted==

Semiconductor device assemblies are provided with one or more layers of thermally conductive material disposed between adjacent semiconductor dies in a vertical stack. The thermally conductive material can be configured to conduct heat generated by one or more of the semiconductor dies in laterally outward towards an outer edge of the assembly. The layer of thermally conductive material can comprise one or more allotropes of carbon, such as diamond, graphene, graphite, carbon nanotubes, or a combination thereof. The layer of thermally conductive material can be provided via deposition (e.g., sputtering, PVD, CVD, or ALD), or via adhering a film comprising the layer of thermally conductive material to one or more of the semiconductor dies.



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