View source for 18741290. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)

=PRINTED CIRCUIT BOARD=


==Organization Name==

[[:Category:Samsung Electro-Mechanics Co., Ltd.|Samsung Electro-Mechanics Co., Ltd.]]


[[Category:Samsung Electro-Mechanics Co., Ltd.]]

==Inventor(s)==

[[:Category:Jae Ho Shin of Suwon-si KR|Jae Ho Shin of Suwon-si KR]][[Category:Jae Ho Shin of Suwon-si KR]]

[[:Category:Jae Woong Choi of Suwon-si KR|Jae Woong Choi of Suwon-si KR]][[Category:Jae Woong Choi of Suwon-si KR]]

==PRINTED CIRCUIT BOARD==


This abstract first appeared for US patent application 18741290 titled 'PRINTED CIRCUIT BOARD

==Original Abstract Submitted==

A printed circuit board includes a first substrate including a first antenna pattern; a second substrate disposed on a first substrate and including a second antenna pattern; a metal layer disposed between the first and second substrates; and a bonding layer disposed between the first and second substrates. At least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, each of the first and second substrates includes an organic material, and the bonding layer includes an inorganic material.



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[[Category:CPC_H05K1/185]]