View source for 18738111. MULTI-CIRCUIT HEAT PUMP (Carrier Corporation)

=MULTI-CIRCUIT HEAT PUMP=


==Organization Name==

[[:Category:Carrier Corporation|Carrier Corporation]]


[[Category:Carrier Corporation]]

==Inventor(s)==

[[:Category:Chaitanya Halbe of Liverpool NY (US)|Chaitanya Halbe of Liverpool NY (US)]][[Category:Chaitanya Halbe of Liverpool NY (US)]]

[[:Category:Vishnu Sishtla of Syracuse NY (US)|Vishnu Sishtla of Syracuse NY (US)]][[Category:Vishnu Sishtla of Syracuse NY (US)]]

==MULTI-CIRCUIT HEAT PUMP==


This abstract first appeared for US patent application 18738111 titled 'MULTI-CIRCUIT HEAT PUMP




==Original Abstract Submitted==

A multi-circuit heat pump is disclosed. The heat pump comprises an evaporator, a plurality of condensers fluidically connected in series, and a plurality of compressor units configured between the evaporator and the plurality of condensers such that one of the compressor units is fluidically configured between the evaporator and one of the condensers.



[[Category:F25B7/00]]
[[Category:F25B6/02]]
[[Category:F25B30/02]]
[[Category:CPC_F25B7/00]]