View source for 18704766. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS (KYOCERA CORPORATION)

=SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS=


==Organization Name==

[[:Category:KYOCERA CORPORATION|KYOCERA CORPORATION]]


[[Category:KYOCERA CORPORATION]]

==Inventor(s)==

[[:Category:Hironobu Fujiwara of Higashiomi-shi (JP)|Hironobu Fujiwara of Higashiomi-shi (JP)]][[Category:Hironobu Fujiwara of Higashiomi-shi (JP)]]

[[:Category:Takeo Satake of Higashiomi-shi (JP)|Takeo Satake of Higashiomi-shi (JP)]][[Category:Takeo Satake of Higashiomi-shi (JP)]]

==SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS==


This abstract first appeared for US patent application 18704766 titled 'SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS




==Original Abstract Submitted==

A semiconductor package includes a body, a fixing member, and a bond joining the body and the fixing member. The body includes a base and a frame including an inner side surface, an outer side surface, and an opening portion extending through the frame in a first direction. The fixing member includes a first portion located in the opening portion, a second portion continuous with the first portion and located on the outer side surface of the first portion, and a through-hole extending through the first portion and the second portion in the first direction. The bond is located between the first portion and the opening portion. The opening portion at least partially includes a first linear portion. The first portion includes a second linear portion facing the first linear portion. The bond has a smallest thickness between the first linear portion and the second linear portion.



[[Category:H01S5/02315]]
[[Category:H01L31/0203]]
[[Category:H01L31/0232]]
[[Category:H01S5/02218]]
[[Category:H01S5/0225]]
[[Category:CPC_H01S5/02315]]