View source for 18675679. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:DOOHWAN Lee of CHEONAN-SI (KR)|DOOHWAN Lee of CHEONAN-SI (KR)]][[Category:DOOHWAN Lee of CHEONAN-SI (KR)]]

[[:Category:JUNGSOO Byun of SEOUL (KR)|JUNGSOO Byun of SEOUL (KR)]][[Category:JUNGSOO Byun of SEOUL (KR)]]

==SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18675679 titled 'SEMICONDUCTOR PACKAGE

The semiconductor package described in the abstract includes a frame with a through-opening, two semiconductor chips stacked on top of each other, connection pads on the active surfaces of the chips, bumps and posts for electrical connections, and a connection member with a redistribution layer.

* The package features two semiconductor chips stacked vertically, maximizing space efficiency.
* Connection pads on the active surfaces of the chips allow for electrical connections.
* Bumps and posts provide electrical connections between the chips and the connection member.
* Dummy bumps and posts are included at the same level as the functional ones for structural support.
* The connection member includes a redistribution layer for efficient electrical connections.

Potential Applications:
- This technology can be used in various electronic devices requiring compact semiconductor packaging.
- It can be applied in mobile devices, IoT devices, and other compact electronic systems.

Problems Solved:
- Addresses the need for efficient and compact semiconductor packaging solutions.
- Provides a reliable method for stacking and connecting multiple semiconductor chips.

Benefits:
- Space-efficient design for compact electronic devices.
- Reliable electrical connections between stacked semiconductor chips.
- Improved structural support with dummy bumps and posts.

Commercial Applications:
Title: Advanced Semiconductor Packaging Technology for Compact Electronic Devices
This technology can be utilized in the production of smartphones, tablets, wearables, and other compact electronic devices. The efficient stacking and electrical connections provided by this semiconductor package can enhance the performance and reliability of such devices in the market.

Questions about Semiconductor Packaging Technology:
1. How does the inclusion of dummy bumps and posts improve the structural integrity of the semiconductor package?
- The dummy bumps and posts provide additional support and stability to the stacked semiconductor chips, ensuring the overall structural integrity of the package.
2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production?
- Mass production of semiconductor packages with stacked chips may require precise manufacturing processes to ensure consistent quality and performance.


==Original Abstract Submitted==

A semiconductor package includes a frame having a through-opening, a first semiconductor chip disposed in the through-opening and having a first active surface on which a first connection pad is disposed and a first inactive surface opposing the first active surface, a second semiconductor chip disposed on the first semiconductor chip and having a second active surface on which a second connection pad is disposed and a second inactive surface opposing the second active surface, first and second bumps electrically connected to the first and second connection pads, respectively, first and second dummy bumps disposed on a same level as levels of the first and second bumps, respectively, first and second posts electrically connected to the first and second bumps, respectively, a connection member including a redistribution layer electrically connected to each of the first and second posts, and a dummy post disposed between the frame and the connection member.



[[Category:H01L25/065]]
[[Category:H01L23/00]]
[[Category:H01L23/04]]
[[Category:H01L23/31]]
[[Category:H01L23/538]]
[[Category:CPC_H01L25/0657]]